OLED Encapsulation Obstruction Wall for Hermetic Sealing
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Solution Overview
Problem
Existing thin film encapsulation structures for OLED devices are inadequate in preventing water vapor and oxygen ingress, leading to reduced device lifespan due to gaps between layers and substrates.
Innovation Solution
An encapsulation structure featuring an obstruction wall between opposing substrates with recesses and depressed sections to seal the encapsulating thin film, potentially filled with inert gases or desiccants, and using UV-solidified or laser-sintered glass obstruction walls, along with multi-layered organic and inorganic thin films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a thin film encapsulation structure is used to achieve lightness and thinness, then the device weight and thickness are reduced, but the sealing effectiveness deteriorates due to gaps between layers and substrates allowing water vapor and oxygen ingress
Solution Approach 1:
The encapsulation structure is divided into multiple functional layers: a base substrate, an encapsulating thin film with multiple barrier layers, and a separate obstruction wall structure. This segmentation allows each component to specialize in specific functions - the thin film provides lightweight barrier protection while the obstruction wall provides mechanical sealing, resolving the contradiction between lightness and sealing effectiveness
Solution Approach 2:
The obstruction wall acts as an intermediary element between the encapsulating thin film and the edge of the base substrate. It fills the gap and provides a mechanical barrier that prevents water vapor and oxygen from reaching the thin film edges, thereby enhancing sealing effectiveness without compromising the overall thin and lightweight structure
2Weight of moving object
If the encapsulating thin film is made thinner to achieve lightness, then the device weight is reduced, but the obstruction performance against water vapor and oxygen deteriorates
Solution Approach 1:
The encapsulating thin film is constructed as a composite structure with multiple layers having different barrier properties. This includes alternating organic and inorganic layers, where inorganic layers provide superior water vapor and oxygen barrier properties while organic layers provide flexibility and stress relief. This composite approach maintains thinness and lightness while enhancing obstruction performance through the synergistic combination of different materials
Solution Approach 2:
The obstruction wall adds a vertical dimension to the encapsulation system by extending upward from the substrate edge. This creates a three-dimensional sealing structure that prevents harmful factors from laterally approaching the thin film edges, effectively compensating for the reduced barrier thickness in the horizontal dimension
3Ease of manufacture
If gaps are left between the encapsulating thin film and substrate edges for manufacturing flexibility, then the ease of manufacture is improved, but the sealing effectiveness deteriorates due to pathways for water vapor and oxygen ingress
Solution Approach 1:
The sealing function is extracted from the encapsulating thin film itself and assigned to a separate obstruction wall structure. This allows the thin film to be manufactured independently with standard techniques while the obstruction wall is added subsequently to provide the sealing function, separating the manufacturing requirements from the sealing requirements and improving both ease of manufacture and sealing effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the sealing effectiveness, reducing water vapor and oxygen ingress, thereby prolonging the OLED device's service life by creating a more robust and hermetic environment.
Implementation Method 1
Water vapor and oxygen that permeate into OLED devices are main factors that affect the lifetime of the OLED devices
Implementation Method 2
the obstruction wall comprises a sealant subjected to UV solidification
Implementation Method 3
the obstruction wall comprises a glass obstruction wall formed by laser sintering
Data Source
AI summary
An encapsulation structure of OLED device, comprising an upper substrate and a lower substrate that are disposed in opposition to each other. An OLED device is provided on the lower substrate, and an encapsulating thin film is provided on the OLED device. An edge of the lower substrate and an edge of the upper substrate are hermetically coupled through an obstruction wall, and there is a recess at the edge of the lower substrate on the side facing the upper substrate. One end of the obstruction wall that is coupled to the lower substrate is positioned within the recess of the lower substrate, and configured to seal the periphery of the encapsulating thin film within the recess of the lower substrate. With the encapsulation structure, the effect of water vapor and oxygen on the OLED device can be reduced, and service life of the OLED device is prolonged.