OLED Package UV Absorbing Layer for Flexible Display Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current OLED packaging technologies face challenges in protecting organic light-emitting diodes from damage caused by external ultraviolet light, which affects the device's lifetime and is exacerbated by the higher costs and technical complexities of thin film encapsulation methods.
Innovation Solution
Incorporating a UV-absorbing layer containing titanium dioxide particles into the OLED package, which is formed on a substrate with a baseplate and pixel-defining layer, and includes a first inorganic layer to block water and oxygen, effectively reducing damage from external UV light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thin film encapsulation (TFE) is used to protect OLED from water and oxygen, then the water-oxygen transmission rate is improved, but the cost and technical investment increase
Solution Approach 1:
The encapsulation structure is divided into multiple functional layers: an inorganic layer for water and oxygen barrier, and an organic UV-absorbing layer for ultraviolet protection. This segmentation allows each layer to specialize in protecting against specific harmful factors, achieving comprehensive protection while maintaining manufacturing feasibility.
Solution Approach 2:
The patent combines inorganic materials (for water and oxygen barrier) with organic UV-absorbing materials in a composite encapsulation structure. This composite approach leverages the strengths of different material types to simultaneously address multiple degradation pathways affecting OLED reliability.
2Object-affected harmful factors
If traditional glass encapsulation is used, then UV protection is provided, but the device flexibility and thickness are reduced
Solution Approach 1:
The patent replaces rigid glass encapsulation with thin film encapsulation consisting of inorganic and organic layers. These thin films provide equivalent protection against water, oxygen, and UV light while enabling device flexibility and reducing overall thickness, thus supporting flexible display applications.
Solution Approach 2:
The encapsulation approach transitions from thick rigid glass to thin flexible films, changing the physical parameters of the protective layer. This parameter change maintains protective functionality while improving device flexibility and reducing thickness.
3Ease of operation
If organic light-emitting material is exposed to ultraviolet light, then the device can operate, but the material is damaged causing voltage increase and reduced lifetime
Solution Approach 1:
An organic UV-absorbing layer is introduced as an intermediary between the ultraviolet environment and the organic light-emitting material. This intermediary layer absorbs harmful UV radiation before it reaches the light-emitting material, protecting it from degradation while allowing the device to operate normally.
Solution Approach 2:
The UV-absorbing layer provides preliminary protection by absorbing ultraviolet light before it can damage the organic light-emitting material. This preventive measure stops the harmful action of UV radiation in advance, preventing material degradation and extending device lifetime.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The UV-absorbing layer significantly reduces the impact of external UV light on OLED devices, enhancing their durability and potentially lowering production costs by integrating a flexible display solution.
Implementation Method 1
preparing an ultraviolet absorbing layer on the first inorganic layer
Implementation Method 2
the ultraviolet absorbing layer comprises an organic monomer and titanium dioxide particles distributed in the organic monomer
Data Source
AI summary
The present disclosure discloses an organic light-emitting diode package, a display panel and a method for manufacturing the same. The method may include: providing a substrate comprising a baseplate, a pixel-defining layer disposed on the baseplate and a light-emitting layer disposed in an opening of the pixel-defining layer, wherein the light-emitting layer comprises an organic light-emitting diode; forming a first inorganic layer on the substrate; preparing an ultraviolet absorbing layer on the first inorganic layer; and forming a planarization layer and a second inorganic layer in sequence on the ultraviolet absorbing layer. The implementation of the present disclosure may effectively reduce the damage from external ultraviolet light to the organic light-emitting diode.


