OLED Packaging Lid Air Channels for Resin Flushing
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Solution Overview
Problem
The existing OLED packaging methods face issues with resin flushing due to air pressure differences between the inside and outside of the packaging structure, which affects the sealing performance, water resistance, and mechanical strength of OLED devices.
Innovation Solution
The method involves forming air channels in the package lid to equalize internal and external air pressures, using a corrugated configuration and acidic corrosion process, and applying a UV-sensitive dam to enhance bonding and sealing, with a desiccant and dam structure where the desiccant's height is less than or equal to the dam's height, and pressing the components together under UV curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the package lid and TFT substrate are bonded using conventional sealing methods, then the bonding process can be completed, but resin flushing occurs due to air pressure difference between inside and outside of the packaging structure
Solution Approach 1:
A vacuum channel is introduced as an intermediary structure within the package lid to mediate the air pressure difference during bonding. The vacuum channel communicates with the packaging interior and allows external vacuum to be applied, equalizing pressure between inside and outside of the package during the bonding process, thereby preventing resin flushing while maintaining bonding quality.
Solution Approach 2:
The air pressure parameter inside the packaging structure is dynamically changed during the bonding process. By applying vacuum through the vacuum channel, the internal pressure is reduced to match the external pressure, eliminating the pressure gradient that causes resin flushing. This parameter change enables successful bonding without the harmful flushing effect.
2Strength
If air pressure difference exists during bonding, then the bonding process proceeds, but the sealing performance and water resistance are compromised
Solution Approach 1:
The vacuum channel serves as an intermediary that enables pressure equalization during bonding. By allowing external vacuum to reach the packaging interior, it ensures that bonding occurs under equal pressure conditions, simultaneously achieving strong bonding and reliable sealing without the compromising effects of pressure differential.
3Strength
If conventional packaging structure is used, then the OLED device is enclosed, but mechanical strength is reduced due to resin flushing
Solution Approach 1:
The package lid is segmented to include a vacuum channel within its structure. This segmentation allows the lid to perform multiple functions: providing structural support and enabling pressure equalization. The vacuum channel is integrated into the lid design, adding minimal complexity while significantly improving mechanical strength by preventing resin flushing.
4Reliability
If vacuum channel is added to package lid, then resin flushing is prevented and sealing is improved, but device complexity increases
Solution Approach 1:
The vacuum channel function is merged with the package lid structure rather than being a separate component. The channel is formed as an integral part of the lid, combining the protective enclosure function with the pressure equalization function. This merging approach improves packaging effectiveness while minimizing the increase in device complexity.
Solution Approach 2:
The package lid is designed with multi-functionality: it provides structural protection, encloses the OLED device, and incorporates the vacuum channel for pressure equalization. By making the lid universal and multi-functional, the design achieves improved packaging effectiveness without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents resin flushing, improves water resistance, increases mechanical strength, and enhances packaging effectiveness by ensuring consistent air pressures and increased engagement area between the dam and package lid.
Implementation Method 1
forming air channels in the package lid to equalize internal and external air pressures
Implementation Method 2
applying a UV-sensitive dam to enhance bonding and sealing, with a desiccant and dam structure where the desiccant's height is less than or equal to the dam's height, and pressing the components together under UV curing
Data Source
AI summary
The present invention provides an OLED packaging method and an OLED packaging structure. The OLED packaging method includes the following steps: providing a TFT substrate (1) and a package lid (2); forming air channels (21) on the package lid (2); forming an OLED device (11) on the TFT substrate (1); coating a loop of desiccant (12) on the TFT substrate (1) along an outer circumference of the OLED device (11) and coating a loop of a dam (13) along an outer circumference of the desiccant (12); laminating the TFT substrate (1) and the package lid (2) together; and pressing the TFT substrate (1) and the package lid (2) together and applying irradiation of ultraviolet light to cure the dam (13). The method effectively eliminates the issue of resin flushing caused by a difference of air pressures inside and outside the packaging structure in bonding the package lid and the TFT substrate so as to improve the property of water resistance, enhance mechanical strength of the packaging structure, and improve packaging effectiveness.