OLED Packaging Metallic Foil Substrate Barrier
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Solution Overview
Problem
Current OLED devices using plastic film substrates face challenges with water and oxygen permeation, leading to damage, while metallic foils offer strong barriers but lack light transmission, and ultra-thin glass is difficult to process.
Innovation Solution
A packaging method using a metallic foil substrate with a passivation layer, encapsulation adhesive, and a second transparent substrate for enhanced barrier properties and top emission configuration, eliminating the need for additional barrier layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plastic film substrate is used, then flexibility and ease of processing are improved, but water and oxygen barrier properties deteriorate
Solution Approach 1:
The patent uses a composite structure combining plastic film substrate with a barrier layer (metallic foil or ultra-thin glass) to achieve both flexibility and water/oxygen barrier properties. The barrier layer is selectively positioned to provide protection while maintaining the overall flexibility of the device.
2Reliability
If metallic foil substrate is used, then water and oxygen barrier properties are improved, but light transmission property deteriorates
Solution Approach 1:
The patent applies the barrier layer (metallic foil) only in specific regions where water and oxygen protection is needed, while leaving other regions transparent for light emission. This localized application allows the device to have both strong barrier properties and good light transmission where required.
3Reliability
If ultra-thin glass substrate is used, then light transmission property and barrier effect are improved, but ease of processing deteriorates
Solution Approach 1:
The patent employs ultra-thin glass as a flexible substrate that combines the barrier properties of glass with the flexibility needed for processing and device bending. The ultra-thin nature allows it to be handled and processed more easily while maintaining its protective barrier function.
4Ease of manufacture
If encapsulation adhesive is used to protect OLED, then ease of manufacture is improved, but water and oxygen permeation increases
Solution Approach 1:
The patent combines encapsulation adhesive with an additional barrier layer (metallic foil or ultra-thin glass) to create a composite packaging structure. The adhesive provides ease of manufacture and bonding, while the barrier layer compensates for the adhesive's poor water and oxygen resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an OLED device with improved water and oxygen barrier properties and extended service life, maintaining a top emission configuration and light transmission.
Implementation Method 1
water and oxygen will still permeate inside of the OLED packaging structure through the encapsulation adhesive
Data Source
AI summary
The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.