OLED Packaging Organic Layer Stress Relief
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Solution Overview
Problem
The brittleness of inorganic layers in thin film packaging of OLED devices leads to stress accumulation and cracking during bending, resulting in uneven brightness and packaging failure in hole areas, affecting product yield.
Innovation Solution
An organic layer is disposed on the inorganic packaging layer in the hole area and peripheral areas, allowing stress release and preventing cracking, with the organic layer extending to cover isolation columns and blocking walls, and using acrylic resin materials to match the organic packaging layer for uniformity and water resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic layers are used in thin film packaging, then packaging sealing performance is improved, but stress cannot be released during bending causing cracks and peeling
Solution Approach 1:
The patent introduces a flexible organic layer disposed on the inorganic packaging layer in the hole area. This organic layer acts as a stress buffer that can deform during bending, preventing stress concentration and crack formation in the brittle inorganic layers while maintaining the sealing function of the packaging structure.
Solution Approach 2:
The patent creates a composite packaging structure by combining inorganic packaging layers with an organic layer. The inorganic layers provide barrier and sealing properties, while the organic layer provides flexibility and stress relief, achieving a synergistic effect that resolves the contradiction between sealing performance and bending resistance.
2Area of stationary object
If inorganic layers extend to hole area, then packaging coverage is improved, but cracking and peeling occur due to stress accumulation
Solution Approach 1:
The patent applies different material properties to different areas: the inorganic packaging layer extends to the hole area to maintain coverage and sealing, while a flexible organic layer is specifically added in the hole area to provide local stress relief. This local quality enhancement prevents cracking where it is most likely to occur without compromising overall packaging coverage.
3Productivity
If thin film packaging is used, then device miniaturization is achieved, but brittleness of inorganic layers causes packaging failure
Solution Approach 1:
The patent changes the physical and chemical parameters of the packaging structure by introducing an organic layer with different mechanical properties (flexibility, elasticity) compared to the inorganic layers. This parameter change allows the thin film packaging to maintain its miniaturized form factor while gaining improved stress resistance and reliability through the composite structure.
Data Source
AI summary
The present application discloses a display panel and a preparation method thereof, and a display device. The display panel includes a base substrate, and has a display area, a peripheral area surrounding the display area, a hole area located at the display area, and an isolation area located between the hole area and the display area. The display area includes an electroluminescent device located on the base substrate, and a packaging structure for sealing the electroluminescent device, the packaging structure includes an inorganic packaging layer and an organic packaging layer alternately stacked, and the inorganic packaging layer extends to the hole area. The isolation area includes an organic layer located on the inorganic packaging layer.