OLED Pad Area Bank for Stress Absorption During Substrate Scribing
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Solution Overview
Problem
The process of partially eliminating the encapsulation substrate in OLED display devices applies stress to the substrate, potentially damaging thin film transistors, organic light emitting elements, and wire patterns, leading to pixel errors and reduced product quality.
Innovation Solution
Incorporating a bank on the substrate in the pad area, which can overlap with the pad and be formed in a bar shape, to absorb stress during the scribing process, and using a second sealing member to reinforce the connection between substrates, ensuring efficient sealing and minimizing empty spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the encapsulation substrate is partially eliminated to expose pads, then the pads can be electrically connected to external devices, but stress is applied to the substrate causing damage to thin film transistors, organic light emitting elements, and wire patterns
Solution Approach 1:
The encapsulation substrate is divided into a light-emitting area that remains intact and a pad area that is eliminated to expose pads. This segmentation allows electrical connection functionality while preserving the integrity of the light-emitting area and its constituent elements.
Solution Approach 2:
Different regions of the encapsulation substrate have different properties: the light-emitting area maintains full encapsulation for protection, while the pad area is eliminated for electrical connection. This local differentiation resolves the contradiction by providing connection capability only where needed without compromising overall substrate integrity.
2Ease of manufacture
If the encapsulation substrate is partially eliminated, then pad exposure is achieved for thermal compression connection, but the eliminating force applies stress to the substrate
Solution Approach 1:
The encapsulation substrate is designed with a pre-determined elimination pattern where the pad area is removed after sealing. This preliminary design of the elimination strategy allows controlled stress application that exposes pads for thermal compression connection while minimizing damage to constituent elements through optimized elimination timing and method.
Data Source
AI summary
An organic light emitting diode (OLED) display device according to an exemplary embodiment of the present invention includes a first substrate, a second substrate, a first sealing member, a pad, and a bank. The first substrate includes a light emitting area and a pad area, the second substrate is disposed to opposite to and face to the first substrate, and the first sealing member is disposed between the first substrate and the second substrate to combine the first substrate and the second substrate. The pad is disposed on the pad area, and the bank is formed on the pad area and is spaced apart from the first sealing member.