OLED Pad Wire Impact Protection via Peripheral Bumps
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Solution Overview
Problem
Organic light emitting diode displays are vulnerable to damage during manufacturing processes, particularly during cutting, due to external impacts, which can lead to defects and reduced lifespan, especially when using flexible substrates.
Innovation Solution
The implementation of a structure with bumps formed between pad wires in the peripheral region of the display, which are part of a protective layer, helps absorb and distribute impact, preventing damage to the pad wires and insulating layers during the cutting process of a temporary upper protective film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is used to enable bending and slimness, then adaptability and weight are improved, but vulnerability to external impact during manufacturing increases
Solution Approach 1:
A protective layer is formed over the flexible substrate and organic light emitting element before the cutting process. This protective layer acts as a cushion that absorbs and distributes external impact during manufacturing processes such as cutting, preventing damage to the underlying fragile components while maintaining the flexible substrate's bending capability.
2Adaptability or versatility
If the organic light emitting element is made thin to enable bending, then adaptability is improved, but strength and resistance to impact worsen
Solution Approach 1:
The protective layer is applied beforehand to the thin flexible substrate structure. This layer provides the necessary strength and impact resistance that the thin structure lacks, while not preventing the overall assembly from bending when needed.
Solution Approach 2:
The invention creates a composite structure combining the flexible substrate, organic light emitting element, and protective layer. This composite structure integrates the bending capability of the flexible substrate with the impact resistance of the protective layer, achieving both adaptability and strength.
3Productivity
If cutting processes are performed to separate individual displays, then productivity is improved, but damage to pad wires and insulating layers increases
Solution Approach 1:
The protective layer is formed before the cutting process to cushion and distribute the impact of cutting tools. This prevents direct contact between the cutting tool and sensitive components like pad wires and insulating layers, enabling safe and efficient separation of individual displays.
Solution Approach 2:
The protective layer serves as an intermediary between the cutting tool and the sensitive components (pad wires, insulating layers). It absorbs the mechanical stress of cutting, allowing the cutting process to proceed without directly damaging the underlying components.
Data Source
AI summary
An organic light emitting diode display includes a substrate including a display region displaying an image and a peripheral region surrounding the display region, a plurality of pad wires formed in the peripheral region of the substrate, and a plurality of bumps formed between the plurality of pad wires. The organic light emitting diode display blocks or relieves impact which is generated when a temporary upper protective film is half-cut and applied to a plurality of pad wires or an insulating layer by forming a plurality of bumps between the plurality of pad wires, thus preventing a damage to the pad wires or the insulating layer.