OLED Display Panel Barrier Structure for Narrow-Bezel Sealing

The barrier structure is segmented into alternating organic and inorganic barrier layers. The inorganic barrier layer is divided into discrete segments that bridge adjacent openings in the organic barrier layer, rather than requiring a continuous inorganic layer. This segmentation reduces manufacturing complexity while maintaining effective moisture and oxygen barrier performance through the combined action of multiple discrete barrier elements.

The barrier structure is formed preliminarily before peripheral circuit wire formation. The alternating organic and inorganic barrier layers are deposited and patterned first, creating a protective framework. Subsequently, peripheral circuit wires are formed within the regions defined by this pre-established barrier structure, ensuring that the wires are protected during manufacturing processes while allowing for reduced border width.

The organic barrier layer serves as an intermediary that defines the pattern and positioning for the inorganic barrier layer. The organic layer is formed first with its openings, then the inorganic barrier layer is deposited to bridge these openings. This intermediary approach simplifies alignment requirements compared to forming continuous inorganic layers, as the organic layer acts as a template that guides the placement of inorganic segments, reducing the need for high-precision alignment between multiple inorganic layers.