OLED Panel Bonding with Integrated Drivers
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Solution Overview
Problem
Conventional OLED devices face challenges in increasing panel size due to IR drops and non-uniform luminance when bonding multiple panels, as drivers are typically formed on multiple sides and production equipment is affected by panel size, leading to inadequate bonding and non-uniform luminance at interfaces.
Innovation Solution
The OLED device is designed with data, scan, and emission control drivers arranged to facilitate easier bonding of multiple electroluminescent panels, where drivers are positioned on a substrate between the pixel portion, with data lines, scan lines, and emission control lines extending parallel to each other, and power supply voltage lines extending from a power supply pad to minimize signal delay and ensure uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple OLED panels are bonded together to increase panel size, then the display area is enlarged, but IR drop occurs and luminance becomes non-uniform at interfaces
Solution Approach 1:
The display device is divided into multiple EL panels that can be independently fabricated and then bonded together to form a larger display area. Each panel maintains the same structure and characteristics, allowing for modular expansion while controlling IR drop and luminance uniformity through proper design of bonding interfaces and power supply routing.
Solution Approach 2:
The power supply voltage lines are routed through the bonding interfaces from the pixel portion toward the data driver, utilizing the vertical dimension to distribute power evenly across multiple panels. This dimensional approach to power distribution reduces IR drop and maintains luminance uniformity at panel interfaces.
2Adaptability or versatility
If drivers are formed at multiple sides of the pixel portion, then the device functionality is complete, but panel bonding becomes inadequate and luminance non-uniformity occurs at interfaces
Solution Approach 1:
The data driver is extracted from the pixel portion and positioned separately on the substrate. This separation allows the pixel portion to be optimized for display functionality while the driver is positioned to facilitate panel bonding, eliminating the conflict between driver placement and panel assembly.
Solution Approach 2:
The scan driver and emission control driver are positioned on the substrate before the pixel portion is fully assembled. This preliminary positioning enables proper alignment and bonding of multiple panels while maintaining complete device functionality, as the drivers are pre-configured to receive signals from the pixel portion.
3Area of stationary object
If panel size is increased, then display area is enlarged, but production equipment is affected and bonding becomes difficult
Solution Approach 1:
The display device is segmented into multiple EL panels of standardized dimensions that can be independently fabricated using existing production equipment. These panels are then bonded together in a modular fashion to achieve larger display areas, reducing the complexity of manufacturing single large panels while enabling equipment optimization for smaller, standardized units.
Data Source
AI summary
An organic light emitting display (OLED) device including a plurality of electroluminescent (EL) panels that are coupled with one another. In order to facilitate the coupling of the EL panels, respective data drivers are disposed at one side of pixels, and a scan driver and an emission control driver are formed in each of the EL panels. Thus, surfaces of the EL panels that are not connected to data drivers may be coupled with one another to form the OLED device. In the OLED device, a data driver is not formed at interfaces between the EL panels, and uniform pixels are arranged, so that non-uniformity in luminance may be prevented.