OLED Panel Barrier Structure for Narrow-Bezel Edge Sealing
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Solution Overview
Problem
OLED devices are susceptible to degradation from moisture and oxygen, and the narrow border design complicates effective sealing, particularly affecting the integrity of peripheral circuits and signal wires during manufacturing.
Innovation Solution
A display panel design incorporating a barrier structure with alternating organic and inorganic barrier layers, where the inorganic layer fills openings in the organic layer to enhance moisture and oxygen barrier effects, while protecting peripheral circuits and signal wires by ensuring they do not overlap with these openings, and using a frame sealant to further secure the border.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the border width is reduced to achieve narrow border design, then the display area is increased, but the sealing effectiveness is compromised and peripheral circuits become vulnerable to moisture and oxygen
Solution Approach 1:
The patent applies composite materials by combining organic and inorganic barrier layers to form a multi-layer barrier structure. The inorganic layer fills openings in the organic layer, creating a composite barrier that effectively blocks moisture and oxygen while maintaining a narrow border design. This composite structure resolves the contradiction by providing enhanced sealing effectiveness in the reduced border space.
Solution Approach 2:
The patent implements the nesting principle by placing the inorganic barrier layer within the openings of the organic barrier layer. The inorganic layer is positioned inside the organic layer's opening, creating a nested configuration that maximizes barrier effectiveness within the constrained border region, thereby maintaining reliability while reducing border width.
2Area of stationary object
If the border width is reduced to achieve narrow border design, then the display area is increased, but the peripheral circuits are more susceptible to damage during manufacturing
Solution Approach 1:
The multi-layer composite barrier structure provides mechanical protection to the peripheral circuits in addition to moisture and oxygen blocking. The combination of organic and inorganic layers creates a more robust structure that protects signal wires from damage during manufacturing processes, resolving the contradiction between narrow border design and circuit protection.
3Ease of manufacture
If a single-layer barrier structure is used, then the manufacturing process is simpler, but the barrier effect against moisture and oxygen is insufficient
Solution Approach 1:
The patent employs composite materials with organic and inorganic barrier layers working together. The inorganic layer fills the openings of the organic layer, creating a synergistic barrier structure that provides superior moisture and oxygen blocking performance compared to single-layer structures, while maintaining reasonable manufacturing complexity.
Solution Approach 2:
The barrier structure is segmented into multiple functional layers: an organic barrier layer with openings and an inorganic barrier layer that fills these openings. This segmentation allows each layer to contribute its specific properties, with the organic layer providing flexibility and the inorganic layer providing dense barrier protection, thereby enhancing the overall barrier effect.
4Ease of manufacture
If openings are provided in the organic barrier layer for manufacturing purposes, then the manufacturing process is facilitated, but the barrier integrity is compromised
Solution Approach 1:
The inorganic barrier layer acts as an intermediary that fills the openings in the organic barrier layer. This intermediary structure maintains the openings for manufacturing access while simultaneously restoring and enhancing the barrier function, preventing moisture and oxygen penetration through the opening areas.
Solution Approach 2:
The composite structure of organic and inorganic layers allows the openings in the organic layer to be filled by the inorganic material, creating a hybrid barrier that maintains both manufacturability (through openings) and integrity (through filled openings providing continuous barrier coverage).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively seals the display panel against moisture and oxygen, reducing damage to peripheral circuits and signal wires during manufacturing, thereby enhancing the reliability and longevity of OLED devices.
Implementation Method 1
an inorganic barrier layer covering the organic barrier layer and filling the opening
Data Source
Figure 1~2A
Figure 2B~2C
Figure 2D
AI summary
A display panel and a manufacture method thereof, and a display apparatus are provided. The display panel has a display region and a border region surrounding the display region, the border region includes a peripheral circuit region and a peripheral region, and the peripheral circuit region is between the display region and the peripheral region; and the display panel includes: a base substrate, a barrier structure, a peripheral circuit, an encapsulation substrate, and an encapsulation sealant. At least a part of the barrier structure is in the peripheral circuit region on the base substrate, and the barrier structure includes: an organic barrier layer and an inorganic barrier layer. The organic barrier layer includes an opening passing through the organic barrier layer, an extension direction of the opening is substantially same as an extension direction of an edge, close to the opening, of the display panel, in the display panel; and the inorganic barrier layer covers the organic barrier layer and fills the opening; the peripheral circuit is on the base substrate and in the peripheral circuit region; the encapsulation substrate is on a side of the barrier structure away from the base substrate; and the encapsulation sealant is filled between the base substrate and the encapsulation substrate, and covers the display region and the peripheral circuit region.