OLED Panel Thin-Film Encapsulation for Light-Transmitting Holes
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Solution Overview
Problem
The encapsulation performance of OLED display panels with light-transmitting areas is inadequate, leading to low light transmission and high manufacturing costs due to susceptibility to moisture and oxygen, as well as challenges in accommodating front camera and sensor requirements.
Innovation Solution
An organic light-emitting display panel design featuring a thin-film encapsulation layer that extends to cover the wall surface of the functional structure layer facing the light-transmitting hole, combined with a manufacturing method that includes forming a functional structure layer, light-emitting layer, and thin-film encapsulation, with a light-transmitting hole that penetrates through to the functional structure layer, and a laser peeling technology for removing the encapsulation layer in the hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a light-transmitting hole is created in the OLED display panel to accommodate front camera and sensors, then the screen ratio is increased and device functionality is improved, but the encapsulation performance deteriorates due to moisture and oxygen invasion through the hole
Solution Approach 1:
The encapsulation layer is extended from a two-dimensional planar structure to a three-dimensional structure by adding a vertical component that wraps around the light-transmitting hole. This dimensional extension allows the encapsulation layer to cover not only the surface but also the side walls of the hole, creating a comprehensive barrier against moisture and oxygen while preserving the light-transmitting function.
Solution Approach 2:
The encapsulation layer is designed as a flexible thin film structure that can conformally coat both the horizontal surface and the vertical side walls of the light-transmitting hole. This flexible film approach allows the encapsulation layer to adapt to the complex three-dimensional geometry of the hole structure, providing effective protection without compromising the optical properties of the display panel.
2Reliability
If the encapsulation layer is extended to cover the wall surface of the light-transmitting hole, then moisture and oxygen protection is improved, but the manufacturing complexity increases
Solution Approach 1:
The encapsulation layer is formed to extend beyond the boundaries of the light-transmitting hole during the initial deposition process, before any subsequent processing steps. This preliminary extension ensures that the encapsulation layer is already in position to provide protection, eliminating the need for additional complex processing steps to add encapsulation material to the hole walls later in the manufacturing sequence.
Solution Approach 2:
The encapsulation layer structure is designed to automatically provide the necessary protection through its own geometric configuration. By extending the layer to cover the side walls, the structure creates its own comprehensive encapsulation without requiring external assistance or additional processing steps, thereby simplifying the overall manufacturing process while maintaining effective protection.
3Adaptability or versatility
If a light-transmitting hole is implemented in the display panel, then device functionality is improved, but light transmission efficiency decreases due to the punching process and structural interruptions
Solution Approach 1:
The display panel structure is designed with differentiated local properties: the light-emitting areas maintain their full encapsulation and optical characteristics for maximum light output, while the light-transmitting hole area is specifically configured with extended encapsulation coverage and appropriate structural features to optimize light transmission to the camera and sensors. This local differentiation allows each area to be optimized for its specific function without compromising the other.
Data Source
AI summary
An organic light-emitting display panel and a manufacturing method thereof are provided. A thin-film encapsulation layer in the organic light-emitting panel extends to cover a wall surface of the functional structure layer facing to a light-transmitting hole, and comprehensively protects the functional structure layer and the light-emitting layer.