OLED Display Panel Encapsulation Layout for Cleaner Electrode Overlap
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Solution Overview
Problem
Conventional OLED display products require improvements in performance, particularly in encapsulation and electrode connection to enhance reliability and reduce manufacturing costs.
Innovation Solution
A display panel design featuring a substrate with an isolation structure enclosing isolation openings, where light-emitting units are formed without a mask, and encapsulation layers with varying sub-portions of different densities and thicknesses to improve encapsulation and electrode connection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional encapsulation methods are used with uniform thickness, then the encapsulation process is simple, but the encapsulation effectiveness and reliability are insufficient
Solution Approach 1:
The encapsulation layer is divided into multiple sub-portions (first sub-portion, second sub-portion, third sub-portion) with different thicknesses and densities. Each sub-portion serves specific functions: the first sub-portion provides baseline encapsulation, the second sub-portion with higher density enhances barrier properties, and the third sub-portion extends coverage. This segmentation resolves the contradiction by achieving improved encapsulation effectiveness through structured division rather than uniform thickness.
Solution Approach 2:
Different regions of the encapsulation layer are assigned different thicknesses and material densities based on local requirements. Areas requiring enhanced protection (such as over isolation structures or in specific device regions) receive thicker, higher-density sub-portions, while other areas use standard thickness. This local quality approach improves overall reliability without uniformly increasing complexity throughout the entire device.
2Manufacturing precision
If mask-based methods are used to form light-emitting units, then precise positioning is achieved, but manufacturing costs increase
Solution Approach 1:
The isolation structure is formed in advance with precise geometric features that serve as built-in positioning references. The light-emitting units are subsequently formed using these pre-established isolation features as guides, eliminating the need for separate mask alignment steps. This preliminary action of creating the isolation structure first provides the necessary positioning precision while simplifying the overall manufacturing process and reducing costs.
Solution Approach 2:
The isolation structure performs dual functions: it provides electrical/isolation functionality and simultaneously serves as a positioning template for light-emitting unit formation. The structure's own geometric features (such as sidewalls and top surfaces) define the placement locations of light-emitting units, allowing the structure to guide its own subsequent fabrication steps without external masking tools, thereby reducing manufacturing complexity and cost.
3Reliability
If electrode coverage is extended to improve connection, then electrode area increases, but material residue on isolation structure sidewalls increases
Solution Approach 1:
The encapsulation layer's thickness and material density are varied across different regions to create a gradient structure. By adjusting these parameters, the encapsulation layer can effectively cover electrodes that extend onto isolation structures while preventing material residue through controlled deposition profiles. The varying thickness ensures complete electrode coverage for reliable connection in critical areas while maintaining cleaner sidewalls in other regions.
Data Source
AI summary
The present application discloses a display panel, a preparation method for a display panel, and a display device. The display panel includes a substrate, an isolation structure, a light-emitting layer, first electrodes, and a first encapsulation layer. The isolation structure is arranged on a side of the substrate and encloses isolation openings. The light-emitting layer includes light-emitting units at least partially located within the isolation openings. The first electrodes are arranged on a side of the light-emitting units facing away from the substrate, a first electrode overlapping with a first isolation portion. The first encapsulation layer includes encapsulation portions located on a side of the first electrodes facing away from the substrate, each encapsulation portion including a first sub-portion formed of an inorganic material, the first sub-portion covering the first electrode, and the first sub-portions of at least two of the encapsulation portions having different thicknesses.