OLED Panel Sealing with Ribbed Bonding Layer and Inorganic Cover
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current OLED packaging technologies require expensive and complex processes due to the need for multiple devices and materials, which compromise the flexibility and durability of OLED devices by failing to effectively protect them from moisture and oxygen.
Innovation Solution
An OLED panel structure comprising a substrate with an inorganic cover layer, a bonding layer with ribs forming an airtight space, and a barrier layer, filled with inert gas or nitrogen, to isolate the OLED element from external moisture and oxygen, using a simplified process involving PECVD and laminating machines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thin film packaging technology is used to protect OLED from moisture and oxygen, then the OLED is protected from corrosion, but the packaging process becomes complicated and expensive requiring multiple different packaging devices
Solution Approach 1:
The patent combines multiple packaging functions into a single integrated structure. The inorganic cover layer serves both as a protective barrier and as part of the sealing structure, eliminating the need for separate packaging devices and processes while maintaining effective protection against moisture and oxygen.
Solution Approach 2:
The inorganic cover layer performs multiple functions simultaneously: it provides moisture and oxygen barrier protection, forms the sealing structure with the bonding layer, and creates the airtight space. This multi-functionality reduces the number of required packaging components and simplifies the overall process.
2Reliability
If multiple packaging devices and materials are used to protect OLED, then the OLED is effectively sealed, but the production cost increases
Solution Approach 1:
The patent merges the functions of multiple packaging materials into a single integrated inorganic cover layer structure that works in conjunction with the bonding layer. This consolidation reduces material costs and simplifies manufacturing while maintaining effective sealing.
Solution Approach 2:
The invention uses a cost-effective inorganic cover layer material that can be deposited using standard PECVD equipment already available in OLED manufacturing, replacing expensive specialized packaging materials and reducing overall production costs.
3Ease of manufacture
If a simplified packaging process is used for OLED, then production cost is reduced, but the protection from moisture and oxygen may be compromised
Solution Approach 1:
The patent applies local quality by creating a specific rib structure in the bonding layer at critical sealing locations. These ribs form airtight spaces that provide enhanced protection at key areas where moisture and oxygen penetration is most likely, ensuring reliable sealing despite the simplified overall process.
Solution Approach 2:
The invention uses a composite structure combining the inorganic cover layer with the bonding layer containing rib features. This composite design provides both the simplicity of a single-process deposition and the complex protection needed for effective moisture and oxygen barrier performance.
Data Source
AI summary
The present disclosure provides an OLED panel, an OLED packaging method, and a display panel. The OLED panel includes a substrate; an OLED element on a surface of the substrate; an inorganic cover layer on the substrate and the OLED element, the inorganic cover layer being configured to cover a peripheral portion of the surface of the substrate; a bonding layer on the inorganic cover layer; and a barrier layer on the bonding layer, wherein a portion of the bonding layer on the peripheral portion includes at least one rib configured to form an airtight space for isolating the OLED element from the external.