OLED Panel Thermally Conductive Adhesive Heat Dissipation
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Solution Overview
Problem
Organic light-emitting diode (OLED) display panels face performance degradation and reduced service life due to heat generation during light emission, as existing heat dissipation methods are inefficient, leading to increased temperature and non-uniform brightness.
Innovation Solution
Incorporation of a thermally conductive structure, including thermally conductive particles or layers with high thermal conductivity, such as silver, copper, or graphene, within the package adhesive layer and between the light-emitting unit and package structure, along with a heat dissipation structure featuring a heat sink and fins, to enhance heat dissipation and contact area for rapid and uniform heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional package structure is used to cover the light-emitting unit, then the OLED is protected and packaged, but heat accumulates causing temperature increase and performance degradation
Solution Approach 1:
The patent introduces a thermally conductive adhesive layer as an intermediary substance between the light-emitting unit and the package structure. This adhesive layer has high thermal conductivity to facilitate heat transfer from the OLED to the package structure, while still performing the packaging function. The thermally conductive adhesive acts as a mediator that enables efficient heat dissipation without compromising the protective packaging function.
Solution Approach 2:
The package structure is designed as a composite system combining the package structure itself with a thermally conductive adhesive layer. This composite structure integrates both packaging and heat dissipation functions, where the thermally conductive adhesive layer provides thermal management capabilities while the package structure provides mechanical protection and sealing.
2Illumination intensity
If the OLED emits light continuously, then the display function is maintained, but heat is generated causing non-uniform brightness and performance degradation
Solution Approach 1:
The patent converts the harmful heat energy generated during light emission into a manageable thermal flow. By introducing the thermally conductive adhesive layer, the previously harmful heat accumulation is transformed into a controlled heat transfer process, where heat is efficiently conducted away from the light-emitting unit to the package structure, preventing temperature rise and brightness non-uniformity.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the interface between the light-emitting unit and the package structure. By using a thermally conductive adhesive layer with high thermal conductivity, the thermal transport properties are significantly improved, enabling efficient heat dissipation and maintaining uniform brightness during continuous operation.
3Strength
If the package structure is made thicker to improve protection, then mechanical strength is enhanced, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent applies local quality enhancement by concentrating high thermal conductivity material (thermally conductive adhesive layer) at the critical heat generation interface between the light-emitting unit and the package structure. This localized thermal management solution addresses heat dissipation needs at the source without requiring the entire package structure to be thick or complex, thus maintaining mechanical strength while improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents temperature increase, improves performance, stability, and uniformity of brightness in OLED display panels by rapidly dissipating heat, thereby extending the service life and maintaining display quality.
Implementation Method 1
a thermally conductive structure, and the thermally conductive structure is at a side of the light-emitting unit far away from the substrate
Implementation Method 2
a heat dissipation structure provided at a side of the package structure far away from the substrate, wherein an outer surface of the heat dissipation structure has a larger area than that of a surface of the package structure on which the heat dissipation structure is provided
Implementation Method 3
an outer surface of the heat dissipation structure has a larger area than that of a surface of the package structure on which the heat dissipation structure is provided
Data Source
AI summary
The present invention provides an organic light-emitting display panel, comprising: a substrate; a light-emitting unit provided on the substrate; and a package structure covering the light-emitting unit. The organic light-emitting display panel further comprises a thermally conductive structure, and the thermally conductive structure is at a side of the light-emitting unit far away from the substrate. Correspondingly, the present invention further provides a display device. The thermally conductive structure provided by the present invention can rapidly dissipate the heat generated by the light-emitting unit, so that the organic light-emitting display panel has an improved performance and the display device has an extended service life.