OLED Package Component With Patterned Blocking Layer
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Solution Overview
Problem
Conventional OLED device packaging methods face issues with thin film peeling due to bending stress and leakage, particularly when using Ink-jet printing to form the buffer layer, and require improved heat dissipation and material utilization.
Innovation Solution
A package component for OLED devices featuring a first blocking layer with alternating thickness patterns and a buffer layer containing heat-dissipating particles, applied using techniques like PECVD or Ink-jet printing, to reduce stress and prevent leakage while enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the blocking layer is made thicker to improve oxygen and water blocking ability, then the blocking performance is improved, but the stress during bending increases making the thin film more prone to peeling
Solution Approach 1:
The blocking layer is designed with non-uniform thickness, having a first thickness in a first region and a second thickness in a second region. This local variation in thickness allows the blocking layer to provide enhanced blocking performance in specific areas while reducing stress concentration in other regions, thereby preventing peeling during bending operations.
Solution Approach 2:
The thickness parameter of the blocking layer is changed across different regions of the OLED device. By adjusting the thickness parameter spatially, the patent achieves optimal balance between blocking performance and mechanical flexibility, resolving the contradiction between these two requirements.
2Productivity
If Ink-jet printing is used to form the buffer layer to save cost and improve material utilization, then manufacturing efficiency is improved, but leakage may occur during the printing process
Solution Approach 1:
The buffer layer is formed before the blocking layer in the manufacturing process. This preliminary action allows the buffer layer to be properly deposited and stabilized before subsequent layers are added, preventing leakage issues that might occur during the Ink-jet printing process while maintaining cost efficiency and material utilization benefits.
3Length of stationary object
If the OLED device is made thinner to improve design flexibility, then device thinness is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The buffer layer is formed with a porous structure containing voids or cavities. These porous features provide thermal pathways that facilitate heat dissipation from the thin OLED device, allowing effective heat management despite the reduced device thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The patterned blocking layer reduces stress during bending and prevents peeling, while the heat-dissipating particles improve heat dissipation and extend the OLED device's resistance to water and oxygen, thereby extending its lifespan.
Implementation Method 1
a buffer layer coated on the first blocking layer, including heat-dissipating particles
Implementation Method 2
covering the OLED device with a first blocking layer
Data Source
AI summary
The present invention provides a package component of an Organic Light Emitting Diode (OLED) device and a package method thereof, and a display device. A first blocking layer covers the OLED device. A side of the first blocking layer far away from the OLED device includes a first pattern region and a second pattern region alternately set along a predetermined direction, and thickness of the first blocking layer at the first pattern region is smaller than that at the second pattern region.