OLED Pixel Patterning With Inverse Tapered Openings for XR Displays

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Display apparatuses for XR applications face challenges in achieving high definition, low power consumption, and small size due to difficulties in manufacturing organic EL light-emitting layers for small pixel sizes, particularly in glasses-type or goggle-type housings.

Innovation Solution

A method for manufacturing a display apparatus involving specific steps to form insulators, conductors, and EL layers with inverse tapered structures, allowing for precise pixel formation and efficient power management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the pixel size is reduced to increase the number of pixels in a predetermined size, then the resolution is improved, but the formation of organic EL light-emitting layers for different colors becomes difficult

Engineering Contradiction:
Improvepixel sizeVSAvoidformation of organic EL light-emitting layers
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent divides the light-emitting device into multiple independent sub-pixels, each containing a specific organic EL light-emitting layer for a particular color. This segmentation allows each sub-pixel to be manufactured independently with optimized processes, avoiding the difficulty of forming multiple color layers simultaneously in a single pixel structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a planar pixel arrangement to a three-dimensional stacked structure where multiple organic EL light-emitting layers are positioned at different vertical levels. This dimensional change enables independent formation of each color layer without requiring precise lateral alignment, thus facilitating manufacturing while maintaining high resolution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the pitch width between pixels and wirings is reduced to increase the number of pixels, then the resolution is improved, but the manufacturing process becomes more limited

Engineering Contradiction:
Improvepitch widthVSAvoidmanufacturing process
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent utilizes vertical stacking to arrange multiple pixels and wirings in the third dimension, effectively increasing the pixel density without further reducing the lateral pitch width. This approach maintains manufacturability by avoiding excessive miniaturization of lateral dimensions while achieving higher resolution through increased vertical integration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where multiple functional layers including organic EL light-emitting layers, charge generation layers, and transport layers are stacked within a compact vertical space. This nesting allows high pixel density without requiring proportionally smaller lateral dimensions, thus preserving manufacturing feasibility.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Area of stationary object

If the display apparatus size is reduced to fit in glasses-type or goggle-type housings, then the portability is improved, but the number of pixels that can be provided is reduced

Engineering Contradiction:
Improvedisplay apparatus sizeVSAvoidnumber of pixels
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent employs vertical stacking to increase the pixel count within a constrained lateral area. By arranging pixels and functional layers in multiple vertical levels, the display apparatus achieves high pixel density without increasing its footprint, making it suitable for compact XR devices while maintaining high resolution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent utilizes thin-film structures for the organic EL light-emitting layers and other functional layers, enabling the display apparatus to achieve high pixel density in a thin profile. This thin-film approach allows the display to be integrated into compact XR housings without sacrificing pixel count or resolution.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the production of high-definition, low-power consumption, and compact display apparatuses suitable for XR devices, enhancing immersion and reducing manufacturing limitations.

Implementation Method 1

forming a second opening portion having an inverse tapered structure and reaching the sacrificial layer in a region overlapping with the first conductor in the photoresist by performing light exposure and development on the photoresist

Methodology Applied
Scientific EffectLight exposure and development: Photography

Implementation Method 2

formation of organic EL light-emitting layers for different colors in pixels

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS12507525B2Display apparatus, electronic device, and method for manufacturing display apparatus
Publication Date: 2025.12.23 SEMICON ENERGY LAB CO LTD
  • US12507525B2 patent drawing
  • US12507525B2 patent drawing
  • US12507525B2 patent drawing

AI summary

A method for manufacturing a display apparatus having high display quality is provided. A method for manufacturing a display apparatus including first to third insulators, first and second conductors, and first and second EL layers is provided. The first conductor is formed over the first insulator, and the second insulator is formed over the first insulator and over the first conductor. A first opening portion reaching the first conductor is formed in the second insulator. A sacrificial layer is formed over the second insulator and over a bottom surface of the first opening portion, and a resist is applied over the sacrificial layer. Light exposure and development are performed on the resist, so that a second opening portion reaching the sacrificial layer is formed in a region overlapping with the first conductor. A third opening portion is formed in a region of a bottom surface of the second opening portion, and the first EL layer is formed over the resist, over the sacrificial layer, and over the first conductor. Then, the resist and the sacrificial layer are removed, whereby the first EL layer over the resist and over the sacrificial layer is removed. The second EL layer is formed over the first EL layer and over the second insulator, and the second conductor and the third insulator are formed in order over the second EL layer.