OLED Panel Electrode Structure With Through-Substrate Power Vias
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Solution Overview
Problem
OLED displays face challenges with power delivery and heat generation as the size of the panels increases, leading to higher power loss and reduced reliability due to premature failure of ohmic contacts at higher temperatures, limiting display brightness, resolution, and size.
Innovation Solution
A flat panel device design featuring a substrate with power lines electrically coupled to pixel circuits through vias, allowing efficient current transmission and reducing the need for external power delivery, while using interconnecting circuitry to distribute power and manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the panel size and resolution of OLED displays are increased, then the display performance (brightness, resolution, size) is improved, but the power loss and heat generation increase
Solution Approach 1:
The patent transitions from planar power delivery to three-dimensional vertical power delivery by routing power lines through vias that penetrate the substrate. This dimensional change allows power to be delivered from the backside of the substrate directly to pixel circuits, reducing the horizontal current path length and associated power losses while enabling larger display sizes and higher resolutions
2Length of moving object
If the panel size of OLED displays is increased, then the display size is improved, but the heat generation increases
Solution Approach 1:
The patent implements vertical power delivery through substrate-penetrating vias that conduct power from the backside to the frontside of the substrate. This three-dimensional approach shortens the current path length, reducing resistive heating and enabling larger display sizes without proportionally increasing heat generation
Solution Approach 2:
The patent introduces an intermediary power delivery architecture where power lines are routed through the substrate itself rather than along the surface. This intermediary pathway through the substrate provides a more efficient thermal management solution by reducing the distance over which heat is generated and dissipated
3Power
If the operating temperature of OLED devices increases, then the power delivery capability is improved, but the reliability deteriorates due to premature failure of ohmic contacts
Solution Approach 1:
The patent employs vertical power delivery through vias to reduce the horizontal current path length. This dimensional change lowers the overall power delivery requirements and operating temperatures, thereby maintaining reliability of ohmic contacts while still achieving adequate power delivery capability
Solution Approach 2:
The patent changes the physical parameters of power delivery by transitioning from surface-level horizontal routing to through-substrate vertical routing. This parameter change in the power delivery architecture reduces current path length and resistive losses, enabling reliable operation at lower temperatures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances power delivery efficiency, reduces heat generation, and improves the reliability of OLED displays by minimizing the impact of temperature on electrical contacts, thereby maintaining performance and increasing production yield.
Implementation Method 1
at least one via traveling through the substrate electrically coupled to the power line
Data Source
AI summary
A flat panel device, such as a flat display, comprises a substrate; a power circuit; a plurality of pixel circuits, each pixel circuit coupled to a self-emitting device; and a plurality of power lines electrically coupled to the plurality of pixel circuits. The plurality of power lines are also electrically coupled to the power circuit by a plurality of vias traveling through the substrate.