OLED Power Supply Wire Overlap Reduces Dead Space
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Solution Overview
Problem
Conventional organic light emitting diode (OLED) display devices have a significant dead space in the peripheral area due to the non-overlapping arrangement of power supply wires and sealants, which limits the display area and increases manufacturing costs.
Innovation Solution
The OLED display device incorporates a first power supply wire that overlaps both the lower substrate and the sealant in the peripheral area, with protrusions that extend from the sealing portions to reduce dead space and integrate the power supply function with laser light absorption and reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the power supply wire is arranged in parallel to the sealant in the peripheral area (non-overlapping arrangement), then the power supply wire does not interfere with the sealant structure, but a relatively large dead space is produced in the peripheral area where no image is displayed
Solution Approach 1:
The power supply wire is configured to overlap with the sealant in the peripheral area, merging the spatial occupation of both components. This allows the wire to pass through the sealant region rather than running parallel to it, thereby utilizing the sealant's spatial footprint and reducing dead space in the peripheral area.
Solution Approach 2:
The wire arrangement transitions from a two-dimensional parallel layout to a three-dimensional overlapping configuration. The power supply wire is positioned to vertically overlap the sealant layer, creating a multi-layer structure that eliminates dead space while maintaining functional separation between the wire and sealant.
2Area of stationary object
If the power supply wire overlaps the sealant in the peripheral area, then dead space is reduced and full-screen display is enabled, but the wire resistance and driving voltage increase
Solution Approach 1:
The power supply wire is divided into multiple segments: a first wire portion in the first peripheral area that overlaps the sealant, and a second wire portion in the second peripheral area that has a different width. This segmentation allows optimization of wire dimensions in different regions to balance dead space reduction with electrical performance.
Solution Approach 2:
The wire width is made non-uniform, with the first wire portion having a greater width than the second wire portion. The wider first wire portion is located where it overlaps the sealant to reduce resistance in the critical display area, while the narrower second wire portion is placed in the non-critical peripheral area, optimizing the balance between dead space reduction and power consumption.
3Object-affected harmful factors
If a separate metal layer is added for laser light absorption and reflection, then laser protection is improved, but manufacturing cost increases
Solution Approach 1:
The power supply wire is designed to serve dual functions: electrical power supply and laser light absorption/reflection. By selecting appropriate wire materials with suitable optical properties, the same wire structure that provides electrical connectivity also protects against laser damage, eliminating the need for a separate protective metal layer and reducing manufacturing complexity and cost.
Solution Approach 2:
The protective function against laser light is merged with the power supply wire structure. The wire material and configuration are selected to inherently provide laser protection through absorption and reflection, combining two previously separate functions (power supply and laser protection) into a single integrated component.
Data Source
AI summary
An organic light emitting diode display includes a lower substrate, a sub-pixel structure, an upper substrate, a sealant, and a first power supply wire. The lower substrate has a display area, a peripheral area, and a pad area. The sub-pixel structure is disposed in the display area on the lower substrate. The upper substrate is disposed on the sub-pixel structure. The sealant is disposed in the peripheral area between the lower substrate and the upper substrate. The first power supply wire is disposed between the lower substrate and the sealant, and overlaps the lower substrate and the sealant. The first power supply wire includes a first protrusion protruding in a first direction that is a direction from the pad area to the display area in the first peripheral area.