Protective Film Peeling Apparatus for OLED Encapsulation
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Solution Overview
Problem
Organic light-emitting display apparatuses are sensitive to moisture and oxygen, which reduces their lifespan, and existing methods struggle to efficiently remove protective films without damaging the encapsulation layers.
Innovation Solution
A peeling apparatus comprising a laser oscillating member, a separation member, and an adhesive member that cuts the protective film into division regions, peels them off while maintaining an interval, and completely removes the film without damaging the encapsulation thin film, using a single pulse laser beam with higher absorption in the protective film than in the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective film is attached to the encapsulation thin film to protect the organic light-emitting display panel during manufacturing and handling, then the reliability and protection of the display panel is improved, but the device complexity and difficulty of removing the protective film without damaging the encapsulation layer increases
Solution Approach 1:
The protective film is divided into multiple division regions through laser cutting, allowing selective removal of specific areas (such as pad portions) without removing the entire protective film. This segmentation enables precise control over which portions are peeled off, reducing the risk of damage to the encapsulation thin film while maintaining protection where needed.
Solution Approach 2:
The laser beam is selectively applied to specific local regions of the protective film (such as pad portions) rather than the entire film. This localized treatment allows the protective film to maintain its protective function in non-pad areas while enabling easy removal in specific areas where access to the encapsulation layer is needed, thus resolving the contradiction between protection and removability.
2Ease of manufacture
If conventional mechanical methods are used to remove the protective film, then the process is simple, but the encapsulation thin film may be damaged and the lifespan of the display apparatus is reduced
Solution Approach 1:
The patent replaces conventional mechanical removal methods (such as peeling or scraping) with laser beam processing. The laser beam cuts the protective film into division regions and facilitates controlled removal without mechanical contact with the encapsulation thin film, thereby maintaining film integrity while achieving effective protective film removal.
Solution Approach 2:
The patent utilizes the optical properties of the protective film and encapsulation thin film by selecting a laser wavelength that is selectively absorbed by the protective film. This parameter change (wavelength selection) enables precise cutting and removal of the protective film without affecting the encapsulation thin film, resolving the contradiction between ease of removal and film integrity.
3Ease of operation
If the entire protective film is removed to access the encapsulation layer, then complete access is achieved, but the risk of damaging the encapsulation thin film and reducing display apparatus lifespan increases
Solution Approach 1:
The protective film is divided into multiple division regions, and only specific portions (such as pad portions) are removed while other portions remain intact. This selective removal provides sufficient access to the encapsulation layer for necessary operations while maintaining protective coverage in other areas, thereby reducing the risk of damage to the encapsulation thin film.
Solution Approach 2:
Instead of removing the entire protective film (excessive action), the patent removes only the necessary portions (partial action) such as pad portions where access is needed. This partial removal achieves the required access while minimizing exposure and potential damage to the encapsulation thin film, resolving the contradiction between ease of operation and harm prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes the protective film from organic light-emitting display panels while preventing damage to the encapsulation thin film, thereby extending the lifespan of the display apparatus.
Implementation Method 1
a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam
Implementation Method 2
The laser oscillating member may be configured to irradiate a laser beam, the laser beam having an absorption ratio with respect to the protective film that is higher than an absorption ratio with respect to the flat display panel
Implementation Method 3
an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction
Data Source
AI summary
An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.