Protruding Cap Driving Chip Integration for OLED Moisture Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of organic electroluminescent devices is complex and costly due to the need for a recessed space formed on the glass cap by sand blasting, and moisture penetration occurs through the area where the cap is attached to the substrate using a conductive bonding film, degrading the device.
Innovation Solution
The solution involves forming outer walls around the active area and attaching the cap only with a sealant, eliminating the conductive bonding film, and placing the driving chip within the cap to prevent moisture and oxygen penetration, while reducing the substrate size and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a recessed space is formed on the glass cap by sand blasting to install the driving chip, then the driving chip can be securely installed, but the manufacturing process becomes complex and costly
Solution Approach 1:
Instead of forming a recessed space on the cap surface to accommodate the driving chip, the patent inverts the approach by making the cap surface protrude from the substrate surface. The driving chip is then installed on this protruding surface, which eliminates the need for complex sand blasting processes while maintaining secure chip installation.
Solution Approach 2:
The patent extracts and eliminates the sand blasting process from the manufacturing sequence. By changing the cap geometry to protrude rather than recess, the complex surface treatment process is removed entirely, simplifying manufacturing while achieving the same functional goal of secure chip mounting.
2Reliability
If a conductive bonding film is used to attach the cap to the substrate, then electrical connection is achieved, but moisture penetration occurs causing device degradation
Solution Approach 1:
The patent extracts and removes the conductive bonding film from the device structure. Instead of using a bonding film that creates moisture penetration paths, the invention uses a protruding cap design where the cap itself serves as the structural and electrical interface, eliminating the harmful bonding film layer that allows moisture ingress.
Solution Approach 2:
The patent employs the cap as a multi-functional component that combines structural support, electrical connection, and moisture barrier functions. By making the cap protrude and directly interface with the substrate, it creates a composite structure where the cap material itself provides both electrical conductivity and moisture protection, eliminating the need for separate bonding films.
3Strength
If the cap is attached to the substrate with bonding film and sealant, then secure attachment is achieved, but moisture can penetrate through the bonding film area
Solution Approach 1:
The patent removes the bonding film component from the attachment system. The protruding cap design allows the cap itself to mechanically interlock with or directly contact the substrate, eliminating the need for bonding films that create moisture penetration pathways while maintaining secure attachment through the cap's structural design.
4Device complexity
If the driving chip is installed outside the cap, then the structure is simpler, but the device size is larger and moisture protection is reduced
Solution Approach 1:
The patent implements a nested structure where the driving chip is installed within the protruding cap, which itself is attached to the substrate. This nesting arrangement consolidates multiple components (substrate, cap, driving chip) into a compact integrated structure, reducing overall device volume while maintaining structural simplicity through the unified protruding cap design.
Data Source
AI summary
The present invention relates to a light emitting display device which comprises a substrate; anode electrode layers disposed over the substrate in a first direction; cathode electrode layers disposed over or under the anode electrode layers in a second direction which is different from the first direction; organic material layers disposed between the anode electrode layers and the cathode electrode layers; at least one outer wall disposed at the periphery of an active area defined by an entire area of the organic material layers; a cap attached over the at least one outer wall, wherein a substrate-forward surface of the cap is flat; a driving chip attached to the substrate-forward surface of the cap; a signal transferring part configured to electrically communicate with the driving chip, and extended to the outside of an area defined by the substrate and the cap; a pad disposed over the substrate, and configured to electrically communicate with the anode electrode layers and/or the cathode electrode layers and electrically communicate with the signal transferring part; and an external signal transferring part configured to electrically communicate with the signal transferring part and to transfer an external signal to the driving chip.