OLED Repair via Conductive Member Reflow

The patent replaces the mechanical pressure-based connection system with a reflow-based connection system. Instead of applying physical pressure to make contacts, the invention uses reflow of conductive members (solder or conductive adhesive) to create electrical connections. This substitution eliminates the mechanical damage to OLED pixels while achieving reliable electrical connection between the driving circuits and OLED panels.

The patent extracts and eliminates the complex micro via formation process from the fabrication sequence. Instead of forming passivation layers and creating millions of micro vias to protect pixels and establish connections, the invention uses a reflow process that directly creates electrical connections through conductive members without requiring protective passivation layers or complex via formation. This extraction of the problematic process step simplifies the overall fabrication process.

The patent segments the fabrication process into separate stages: driving circuits are formed on a first substrate, OLEDs are formed on a second substrate, and then the two substrates are connected through reflow of conductive members. This segmentation allows each component to be optimized and tested independently before final assembly, reducing the propagation of fabrication defects and avoiding processing damage that would occur in integrated single-substrate fabrication.

The patent applies preliminary action by forming the driving circuits and attaching conductive members to the first substrate before the OLED fabrication process. This allows the first substrate to be prepared and tested in advance, and the OLEDs to be fabricated separately on the second substrate. The subsequent reflow process completes the integration, reducing substrate handling steps during critical OLED processing and minimizing errors from dropping, fracturing, or misplacing substrates.