OLED Panel Shock Resistance via Resin Cushioning
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Solution Overview
Problem
Portable electronic devices with organic electroluminescent display panels face challenges in reducing the load applied to the panels while ensuring shock resistance, as they are generally thinner than liquid crystal panels.
Innovation Solution
The use of a light transmissive resin front panel with multiple resin layers of different materials, an adhesive agent layer with lower viscosity, and a metal frame with an elastic cushion to absorb shocks and reduce the load on the OLED panel, along with a touch panel and wavelength panel configuration to enhance shock resistance and light transmittance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If OLED panels are made thinner to reduce device weight and improve design, then device portability and design flexibility are improved, but shock resistance and load bearing capacity deteriorate
Solution Approach 1:
A resin member with shock-absorbing properties is arranged between the OLED panel and the driver circuit board before assembly. This cushioning member pre-positioned in the structure absorbs impact forces and prevents direct transmission of shocks to the thin OLED panel, thereby maintaining shock resistance while allowing the panel to remain thin.
Solution Approach 2:
The patent employs a composite structure combining the thin OLED panel with a resin shock-absorbing member and a rigid driver circuit board. This composite assembly integrates materials with different mechanical properties - the flexible resin layer provides shock absorption while the rigid components maintain structural integrity, enabling the thin panel design to achieve adequate shock resistance.
2Strength
If a rigid substrate is used to support the OLED panel, then structural strength is improved, but shock absorption capability deteriorates
Solution Approach 1:
Instead of making the entire substrate rigid, the patent applies a localized shock-absorbing resin member only in specific regions where impact forces are most likely to affect the OLED panel. This allows the majority of the substrate to maintain rigidity for structural support while providing targeted shock absorption where needed most.
Solution Approach 2:
The resin member acts as an intermediary element positioned between the rigid driver circuit board and the thin OLED panel. It mediates the interaction between these two components by absorbing shock forces while allowing the rigid substrate to maintain its structural strength for supporting the panel.
3Strength
If adhesive layers are used to bond the OLED panel to the substrate, then bonding strength is improved, but shock transmission to the panel increases
Solution Approach 1:
The patent changes the physical parameters of the bonding material by using a resin member with specific viscoelastic properties rather than traditional rigid adhesives. This resin has appropriate viscosity and elasticity parameters that allow it to maintain bonding strength while simultaneously absorbing shock forces, preventing their transmission to the OLED panel.
Solution Approach 2:
The resin member is designed as a sacrificial shock-absorbing element that can deform or fail under extreme impact conditions, protecting the valuable OLED panel. While the resin may need replacement after severe impacts, this inexpensive component serves its purpose of protecting the expensive display element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances the shock resistance of the OLED panel by distributing and absorbing external forces, reducing the likelihood of damage and maintaining high light transmittance, thus addressing the need for improved load management and durability in thinner OLED panels.
Implementation Method 1
a metal frame with an elastic cushion to absorb shocks and reduce the load on the OLED panel
Implementation Method 2
an adhesive agent layer with lower viscosity
Data Source
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AI summary
An electronic device includes a front panel made of resin. The front panel is disposed on the front side of an organic electroluminescent display panel and functions as the front surface of the electronic device; and an adhesive agent layer formed between the organic electroluminescent display panel and the front panel. The organic electroluminescent display panel is fixed to the front panel via the adhesive agent layer. This structure is able to reduce a load applied to the organic electroluminescent display panel and ensure shock resistance for the organic electroluminescent display panel.