OLED Display Routing Lines Preventing Cracks at Adhesive Edges
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Solution Overview
Problem
In organic light emitting diode (OLED) display devices with built-in touch panels, the connection between the touch panel and the OLED array often results in cracks in routing lines due to the overlap with the adhesive layer's edge, leading to increased bezel regions and reduced display areas.
Innovation Solution
The OLED display device incorporates a gate-in-panel (GIP) circuit unit on the lower substrate, where the pad parts of the touch panel array are connected, and second routing lines are formed on the same layer as the GIP circuit unit, connected via conductive metal material, allowing the first routing lines to vertically overlap the adhesive layer's edge with grooves at the overlap regions, preventing cracks and eliminating the need for additional space between pad electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If routing lines are formed to connect pad electrodes on upper and lower substrates, then electrical connection is achieved, but cracks occur in routing lines due to overlap with adhesive layer edges
Solution Approach 1:
The routing lines are repositioned from a horizontal arrangement (parallel to adhesive layer edges) to a vertical arrangement (perpendicular to adhesive layer edges). This dimensional change in routing line orientation eliminates the overlap with adhesive layer edges, preventing crack formation while maintaining electrical connection functionality between pad electrodes on upper and lower substrates
2Reliability
If additional space is allocated for connecting pad electrodes, then connection reliability improves, but display region area decreases
Solution Approach 1:
The pad electrode connection function is merged with the existing GIP circuit unit area. By forming routing lines that connect to pad parts within the GIP circuit unit region rather than requiring separate connection spaces, the display region is maximized while maintaining reliable electrical connections between upper and lower substrates
Data Source
AI summary
An organic light emitting diode (OLED) display device having a built-in touch panel is discussed in which pad parts of a touch panel array are connected on a gate in panel (GIP) circuit unit formed on a lower substrate with an OLED array formed thereon. When an upper substrate is adhered to the lower substrate, occurrence of cracks in routing lines of the touch panel array is prevented. The OLED display device includes a lower substrate provided thereon with an organic light emitting diode array including a thin film transistor and an OLED and a GIP circuit unit, an upper substrate adhered to the lower substrate by an adhesive layer to face each other and provided thereon with a touch panel array including first and second sensor electrodes, and routing lines formed on the GIP circuit unit to be connected to the first and second sensor electrodes.