OLED Sealant Adhesion via Inorganic Insulating Barrier
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Solution Overview
Problem
Conventional OLED devices face issues with sealant spreading and unreliable adhesion, leading to moisture and impurity infiltration, which damages the pixel region and affects product reliability.
Innovation Solution
An OLED device with an inorganic insulating layer and a sealant that contacts the inorganic insulating layer through an opening in the planarization layer, improving adhesion and reducing sealant spreading, using materials like silicon oxide and silicon nitride for the insulating layers and light- or heat-curable epoxy resin for the sealant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the sealant is applied to surround the pixel region and attach upper and lower substrates, then the substrates are bonded together, but the sealant spreads and infiltrates into the pixel region causing damage
Solution Approach 1:
An inorganic insulating layer is introduced as an intermediary between the sealant and the pixel region. This layer acts as a barrier that prevents the sealant from spreading into the pixel region while still allowing the sealant to effectively bond the upper and lower substrates together. The inorganic insulating layer thus mediates between the sealing function and the protection of the pixel region.
Solution Approach 2:
The sealing structure is segmented into distinct functional zones: the sealant is confined to a non-pixel region, separated from the pixel region by the inorganic insulating layer. This segmentation prevents the sealant from infiltrating the pixel region while maintaining effective substrate bonding in the designated sealing area.
2Strength
If the sealant is used to bond substrates, then substrate attachment is achieved, but adhesion is unreliable leading to moisture and impurity infiltration
Solution Approach 1:
The sealing structure uses composite materials including the inorganic insulating layer (such as silicon oxide or silicon nitride) combined with the organic sealant. This composite structure provides both strong adhesion between substrates and reliable protection against moisture and impurities, as the inorganic layer provides barrier properties while the sealant provides bonding.
Solution Approach 2:
The inorganic insulating layer serves as an intermediary that enhances the overall reliability of the sealing system. It provides a stable interface that improves adhesion consistency and prevents moisture and impurity infiltration paths that would otherwise compromise the sealed structure.
3Power
If the common power supply line is arranged on top of the pixel region for voltage supply, then power delivery is achieved, but the sealant overlaps with the power supply line creating potential interference
Solution Approach 1:
The device structure is segmented into pixel regions and non-pixel regions. The common power supply line is positioned in the non-pixel region, and the sealant is also confined to the non-pixel region. This spatial segmentation eliminates overlap between the sealant and power supply line, reducing structural complexity and potential interference while maintaining effective power delivery to the pixel region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of the OLED device by preventing sealant spreading and improving adhesion between substrates, thus reducing damage from external moisture and impurities.
Implementation Method 1
a sealant connecting to the second substrate and contacting the inorganic insulating layer
Implementation Method 2
preventing sealant spreading and improving adhesion between substrates, thus reducing damage from external moisture and impurities
Data Source
AI summary
An organic light emitting display device (OLED) and a method of fabricating the same are disclosed. The organic light emitting display (OLED) device includes: a first substrate having a pixel region and a non-pixel region; an inorganic insulating layer disposed over the first substrate; a planarization layer disposed over the inorganic insulating layer; a second substrate placed over the first substrate; and a sealant connecting to the second substrate and contacting the inorganic insulating layer through a portion of the planarization layer located in the non-pixel region. This configuration improves the adhesion of a sealant, thus reducing damages to an organic light emitting diode in the OLED.


