OLED Sealant Contraction Reinforcement Structure
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Solution Overview
Problem
OLED displays face damage due to external impacts and thermal expansion mismatches between substrates and sealants during the manufacturing process, leading to twisting and deformation of the second mother board, which results in stress and damage to the second substrate.
Innovation Solution
Incorporating a sealant contraction reinforcement auxiliary structure with a thermal expansion coefficient between that of the second substrate and the sealant, positioned between the substrates and the sealant, to compensate for the contraction of the sealant and maintain a consistent gap, thereby reducing stress and damage from external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealant is cured using a laser, then the sealant is cured and encloses the OLED, but the sealant contracts and causes the second mother board to become twisted and deformed
Solution Approach 1:
A buffer layer is introduced as an intermediary component between the sealant and the second substrate. This buffer layer absorbs the contraction stress generated when the sealant is cured, preventing the stress from being transmitted to the second substrate. The buffer layer acts as a mediator that decouples the harmful mechanical interaction between the shrinking sealant and the rigid substrate.
Solution Approach 2:
The buffer layer is positioned in advance between the sealant and the second substrate to provide cushioning against the anticipated contraction stress. By placing this protective layer beforehand, the design preemptively compensates for the harmful effects of sealant shrinkage during the curing process, preventing deformation before it occurs.
2Reliability
If the second mother board and sealant have different thermal expansion coefficients, then the sealant encloses the OLED, but twisting of the second mother board is worsened
Solution Approach 1:
The buffer layer serves as a thermal expansion intermediary between the sealant and the second substrate. It has thermal expansion properties that are intermediate between those of the sealant and the substrate, thereby reducing the thermal mismatch stress. This intermediary layer absorbs differential expansion and contraction during temperature changes, preventing twisting of the second mother board.
3Productivity
If the second mother board is cut using a cutting means, then the OLED display is manufactured, but the second mother board is damaged due to existing stress from twisting
Solution Approach 1:
The buffer layer is placed beforehand to cushion and distribute the internal stresses in the second substrate before the cutting process. By reducing the stress concentration that would otherwise exist due to sealant contraction and thermal mismatch, the buffer layer prevents crack initiation and propagation during the cutting operation, ensuring the structural integrity of the second mother board throughout manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes stress and damage to the OLED display by reducing the thermal expansion difference between the substrates and the sealant, enhancing the display's resistance to external impacts and improving manufacturing yield and cost efficiency.
Implementation Method 1
A thermal expansion coefficient of the sealant contraction reinforcement auxiliary structure may be between a thermal expansion coefficient of the second substrate and a thermal expansion coefficient of the sealant
Data Source
AI summary
An organic light emitting diode (OLED) display includes: a first substrate including an OLED; a second substrate that is opposite to the first substrate; a sealant that is positioned between the first substrate and the second substrate and that couples the first substrate and the second substrate; and a sealant contraction reinforcement auxiliary structure that is positioned in at least one of a position between the first substrate and the sealant and a position between the second substrate and the sealant.