OLED Package Sealant Density Stratification

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Solution Overview

Problem

Existing OLED package structures face performance and lifetime issues due to water and oxygen intrusion, and the use of functional materials for enhancement complicates the fabrication process with double coating and curing requirements.

Innovation Solution

An OLED package structure with a substrate, cover plate, and sealant layers, where a second sealant with lower density than the functional sealant is used to separate the functional sealant layer from the OLED device, and a passivation layer is applied to resist water and oxygen, allowing for a single coating and curing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If functional material is used to be filled in order to enhance the packaging effect, then water absorption property is improved, but device damage risk increases

Engineering Contradiction:
Improvewater absorption propertyVSAvoiddevice damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A second sealant layer is introduced as an intermediary between the substrate and the functional sealant layer. This intermediate layer acts as a buffer that prevents direct contact between the functional material and the OLED device, thereby reducing device damage risk while maintaining the water absorption benefits of the functional material.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If double coating and curing process is used to form OLED package structure, then device damage is reduced, but fabrication process complexity increases

Engineering Contradiction:
Improvedevice damageVSAvoidfabrication process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The second sealant layer and functional sealant layer are combined into a single coating and curing process. The layers are coated sequentially in one operation and cured together, merging what would traditionally be two separate coating and curing cycles into one streamlined process, thereby reducing fabrication complexity while maintaining protective functionality.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If functional material is used for water absorption, then packaging effect is enhanced, but fabrication process time increases

Engineering Contradiction:
Improvepackaging effectVSAvoidfabrication process time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The coating of the second sealant layer and functional sealant layer is merged into a single coating operation, and both layers are cured simultaneously in one curing cycle. This consolidation reduces the total fabrication time while maintaining the enhanced packaging effect provided by the functional material.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the protection of the OLED device from damage by the functional sealant while simplifying the fabrication process by utilizing density differences for fluid stratification and integrating a water-resistant passivation layer, thus improving the package structure's effectiveness and ease of production.

Implementation Method 1

the second sealant has a density less than a density of the functional sealant

Methodology Applied
Scientific EffectDensity difference: Density Gradient

Data Source

PatentUS11271184B2OLED package structure, OLED device, display device and method for fabricating OLED package structure
Publication Date: 2022.03.08 BOE TECHNOLOGY GROUP CO LTD
  • US11271184B2 patent drawing
  • US11271184B2 patent drawing
  • US11271184B2 patent drawing

AI summary

The present disclosure provides an OLED package structure, OLED device, display device and method for fabricating OLED package structure. The OLED package structure includes a substrate, a cover plate and a first sealant layer. The substrate, the cover plate and the first sealant layer together delimiting a sealed space. The OLED package structure further includes a functional sealant layer formed by filling the sealed space with a functional sealant, and a second sealant layer formed by a second sealant disposed between the substrate and the functional sealant layer. The second sealant has a density less than a density of the functional sealant.