OLED Sealant Adhesion via Fill-Up Layer Planarization

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Solution Overview

Problem

The adhesion of the sealant in OLED displays deteriorates due to step differences caused by testing/aging wires, leading to potential separation of the sealing member from the display substrate, which compromises the strength and reliability of the OLED display.

Innovation Solution

The implementation of a fill-up layer, formed from the same material as the semiconductor layer or planarization layer, is disposed under or over the contact region of the conductive wire, which supplements the insulating layer and maintains a flat surface for the second conductive wire and sealant, preventing adherence issues and enhancing the structural integrity of the OLED display.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If testing/aging wires are formed along edges of OLED display, then image quality test and aging process can be performed, but step difference is generated that deteriorates sealant adhesion

Engineering Contradiction:
Improvetesting capabilityVSAvoidsealant adhesion
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

A fill-up layer is introduced as an intermediary structure between the testing/aging wires and the sealant. This fill-up layer fills the step difference created by the wires, providing a flat surface for the sealant and maintaining adhesion while preserving the testing functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The fill-up layer is applied locally only at the edge regions where testing/aging wires are present, rather than across the entire display. This localized approach addresses the adhesion problem at specific problem areas while maintaining the overall structure and functionality of the OLED display.

Inventive Principle:
Principle #3Local quality

2Reliability

If sealant is coated along edge of sealing member, then display substrate can be sealed with sealing member, but sealant may separate from display substrate due to step difference

Engineering Contradiction:
Improvesealing functionVSAvoidsealant adhesion
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The fill-up layer serves as a mediator between the uneven wire structure and the sealant coating process. By providing a flat intermediate surface, it enables proper sealant adhesion and prevents separation while maintaining the sealing function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The fill-up layer is formed in advance before the sealant is coated. This preliminary action creates a flat surface that prevents adhesion deterioration during the subsequent sealant coating process, ensuring proper sealing.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If insulating layer is formed over conductive wire, then electrical insulation is provided, but step difference deteriorates sealant adhesion

Engineering Contradiction:
Improveelectrical insulationVSAvoidsealant adhesion
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The fill-up layer acts as an intermediary that compensates for the step difference created by the insulating layer over the conductive wire. It provides a flat surface for the sealant while preserving the electrical insulation function of the insulating layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS8841832B2Organic light emitting diode display having improved strength by preventing the exfoliation of a sealant
Publication Date: 2014.09.23 SAMSUNG DISPLAY CO LTD
  • US8841832B2 patent drawing
  • US8841832B2 patent drawing
  • US8841832B2 patent drawing

AI summary

An organic light emitting diode (OLED) display. The OLED display includes a first substrate member, a first conductive wire having a contact region and formed over the first substrate member, an insulating layer including a plurality of wire contact holes exposing a part of the contact region of the first conductive wire and formed over the first conductive wire, a second conductive wire formed over the first conductive wire and connected to the first conductive wire through the plurality of wire contact holes of the insulating layer, a sealant formed over the second conductive wire, a sealing member formed over the sealant, and a fill-up layer disposed above or under the contact region of the first conductive wire.