OLED Sealing Bonding Layer With Through Holes
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Solution Overview
Problem
Existing organic light-emitting display apparatuses face challenges in achieving enhanced bonding intensity between the display substrate and the sealing substrate, which can lead to separation under external shocks, compromising the mechanical integrity and longevity of the device.
Innovation Solution
The introduction of a sealing unit with a bonding layer featuring through holes and partition walls, along with a light absorption layer, enhances the bonding force between the display substrate and the sealing material, utilizing a stereoscopic coupling mechanism to prevent separation and improve mechanical intensity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional sealing structure is used, then the device structure is simple, but the bonding intensity between display substrate and sealing substrate is insufficient leading to separation under external shocks
Solution Approach 1:
The bonding layer is segmented into multiple functional components: through holes containing sealing material, partition walls dividing the through holes, and a light absorption layer. This segmentation allows each component to perform its specific function while collectively achieving enhanced bonding intensity and resistance to external shocks.
Solution Approach 2:
The invention transitions from a conventional planar bonding interface to a three-dimensional stereoscopic coupling structure. The through holes extend vertically through the bonding layer, creating depth and volume in the bonding interface. This dimensional change enables the sealing material to bond with both the display substrate and sealing substrate across multiple surfaces, significantly enhancing bonding strength.
2Strength
If the bonding layer is made solid without through holes, then the manufacturing process is simple, but the bonding intensity and mechanical integrity are reduced
Solution Approach 1:
The bonding layer is designed with a porous structure containing multiple through holes that extend through its thickness. These through holes are filled with sealing material that provides strong bonding to both substrates. The porous structure increases the effective bonding area and mechanical interlocking, enhancing overall bonding intensity while allowing for effective sealing material placement.
3Reliability
If partition walls are not included in through holes, then the structure is simpler, but the bonding reliability and resistance to exfoliation are insufficient
Solution Approach 1:
Each through hole is segmented by partition walls that divide the hole into multiple compartments. This segmentation prevents delamination and exfoliation by creating multiple bonding interfaces within each through hole. The partition walls ensure that the sealing material bonds to both substrates across multiple surfaces, significantly improving bonding reliability and resistance to external shocks.
Data Source
AI summary
In an aspect, an organic light-emitting display apparatus is provided, including a display substrate; a sealing substrate configured to face the display substrate; a sealing material for bonding the display substrate and the sealing substrate and surrounding a circumference of the display unit; and a bonding layer comprising a plurality of through holes, wherein the plurality of through holes comprise partition walls therein.