OLED Sealing Layer Crack Prevention via Segmented Insulation

The sealing layer is divided into multiple inorganic insulating layers (first and second inorganic insulating layers) with an organic insulating layer in between. This segmentation allows stress to be distributed across multiple layers rather than concentrated in a single layer, preventing crack formation and propagation while maintaining moisture barrier functionality.

The patent uses a composite sealing structure combining different inorganic materials (such as silicon oxide, silicon nitride, silicon oxynitride) in a multi-layer configuration. Each material layer provides different mechanical and barrier properties, creating a composite structure that is both flexible enough to avoid cracking and effective at blocking moisture.

The sealing layer is segmented into multiple thin inorganic layers separated by an organic layer, which acts as a stress-absorbing buffer during the cutting process. This allows multiple devices to be manufactured on a single mother glass substrate without compromising sealing integrity due to cutting-induced stress.

The organic insulating layer is placed between the inorganic layers beforehand to provide cushioning against stress during subsequent cutting operations. This pre-positioned cushioning layer prevents stress concentration that would otherwise cause cracks during the division of the mother glass into individual devices.

Rather than simplifying the structure, the patent uses segmentation into multiple inorganic layers with an organic intermediate layer to achieve both manufacturability and reliability. Each layer can be deposited using standard semiconductor fabrication techniques, making the multi-layer structure as manufacturable as simpler designs while providing superior crack resistance.

The organic insulating layer is strategically positioned between specific inorganic layers at locations where stress concentration is most likely to occur during manufacturing. This local quality approach places the stress-absorbing material exactly where needed to prevent cracks without adding unnecessary complexity elsewhere in the structure.