OLED Sealing with Metal Foil to Prevent Panel Bending
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Solution Overview
Problem
Existing organic light emitting devices face challenges with increased thickness and manufacturing cost due to the use of sealing glass, which also makes them vulnerable to moisture and prone to bending during the manufacturing process due to thermal expansion coefficient differences between glass substrates and sealing materials.
Innovation Solution
The use of a metal foil with a thermal expansion coefficient similar to that of the glass substrate for sealing the OLED, replacing traditional sealing glass, which includes forming an adhesive layer and bonding the metal foil to the glass substrate through a thermal hardening process, thereby reducing thickness, weight, and manufacturing costs while preventing panel bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing glass is used to protect the OLED from moisture, then reliability is improved, but device thickness and weight increase
Solution Approach 1:
The patent replaces traditional sealing glass with a thin metal foil that is bonded to the glass substrate. The metal foil serves as a thin, effective barrier against moisture while significantly reducing the overall weight and thickness of the sealing structure compared to conventional glass sealing layers.
2Reliability
If sealing glass is used to protect the OLED from moisture, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The metal foil sealing layer is more cost-effective than traditional sealing glass, reducing material costs. The bonding process through thermal hardening of adhesive layer also simplifies manufacturing steps compared to conventional glass sealing methods.
3Reliability
If sealing glass with different thermal expansion coefficient is used, then sealing function is achieved, but panel bending occurs during manufacturing
Solution Approach 1:
The patent selects a metal foil whose thermal expansion coefficient closely matches that of the glass substrate. This homogeneity in thermal expansion properties prevents differential expansion and contraction during manufacturing processes, thereby preventing panel bending and maintaining flatness while still providing effective sealing.
4Reliability
If traditional sealing glass is used, then protection is provided, but device thickness increases
Solution Approach 1:
The thin metal foil replaces the thick sealing glass, providing the same moisture protection function in a much thinner form factor. This significantly reduces the overall device thickness while maintaining the sealing effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively seals the OLED, reduces device thickness and weight, lowers manufacturing costs, and enhances light efficiency by using a metal foil that matches the thermal expansion coefficient of the glass substrate, preventing panel bending and improving display quality.
Implementation Method 1
bonding the metal foil to the glass substrate through a thermal hardening process
Implementation Method 2
using a metal foil that matches the thermal expansion coefficient of the glass substrate, preventing panel bending
Data Source
AI summary
An organic light emitting device and a method for manufacturing that same are discussed, which can reduce thickness and weight of the device as well as the manufacturing cost. The organic light emitting device includes according to an embodiment an organic light emitting diode (OLED) formed on a glass substrate; an adhesive layer formed to cover the OLED; and a metal foil formed on the adhesive layer to seal the OLED and bonded to the glass substrate, wherein the metal foil is formed of an alloy having the same or substantially the same thermal expansion coefficient as that of the glass substrate.