In-Cell Touch OLED Display Sealing Protrusion Connection
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Solution Overview
Problem
Inorganic light emitting diode displays with in-cell type touch panels require a separate process for connecting touch signal transfer wirings to touch electrodes, which can lead to defects and increased production costs due to exposure of touch electrodes and the need for additional insertion steps.
Innovation Solution
The solution involves conductively connecting touch signal transfer wiring on an insulating substrate with a touch wiring under an encapsulation substrate using a protrusion and connection conductor, eliminating the need for a separate additional process and reducing the risk of defects by forming the connection within the sealing member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate insertion process is used to connect touch signal transfer wirings to touch electrodes, then the connection can be established, but the manufacturing complexity increases and the risk of defects increases
Solution Approach 1:
The patent merges the touch signal transfer wiring connection process with the existing sealing member formation process. The protrusion extending through the sealing member integrates multiple functions (sealing and electrical connection) into a single structural element, eliminating the need for separate insertion steps and reducing manufacturing complexity while maintaining connection reliability
Solution Approach 2:
The sealing member is designed to serve multiple functions: it provides sealing protection and simultaneously establishes electrical connection between touch signal transfer wirings and touch electrodes through the protrusion structure. This multi-functionality reduces the number of separate components and processes needed
2Ease of manufacture
If touch electrodes are exposed for connection, then the connection can be made, but defects such as foreign particles and scratches occur
Solution Approach 1:
The protrusion is formed in advance within the sealing member before the final assembly and sealing process. This preliminary formation of the connection structure allows subsequent layers and sealing materials to be applied without exposing the touch electrodes, preventing contamination while maintaining manufacturing ease
Solution Approach 2:
The protrusion acts as an intermediary structure that extends from the sealing member to contact the touch signal transfer wiring. This mediator enables electrical connection without requiring direct exposure of the touch electrodes, thereby preventing defects while maintaining ease of manufacture
3Illumination intensity
If the touch panel is integrated within the display (in-cell type), then visibility is improved, but additional insertion processes are required
Solution Approach 1:
The patent combines the in-cell touch panel integration with the sealing member formation process. The protrusion structure is formed as part of the sealing member manufacturing, merging what would otherwise be separate operations. This maintains the visibility benefits of in-cell integration while improving manufacturing efficiency by reducing the number of distinct process steps
Data Source
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AI summary
Disclosed herein is an organic light emitting diode display, including: an insulating substrate (100) including a display area (DA) in which a plurality of pixels are formed and a peripheral area (PA) positioned around the display area (DA); a touch signal transfer wiring (175) positioned in the peripheral area (PA) on the insulating substrate (100); an insulating layer (180) formed on the insulating substrate (100), the insulating layer (180) covering the touch signal transfer wiring (175) and including a protrusion (180a) and an opening (180b) through which the touch signal transfer wiring (175) is partially exposed; a connection conductor (195a) connected to the touch signal transfer wiring (175) through the opening (180b); an encapsulation substrate (200) including a touch area (TA) corresponding to the display area (DA) and a peripheral area (PA) positioned around the touch area (TA); a touch electrode layer (300) positioned under the touch area (TA) of the encapsulation substrate (200); and a touch wiring (330) connected to the touch electrode layer (300) and positioned under the peripheral area (PA) of the encapsulation substrate (200).