OLED Substrate Sealing via Insulating Layer Recesses
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Solution Overview
Problem
The bonding strength between the upper and lower substrates in OLED displays is a critical factor affecting the lifespan and reliability of these devices, as existing sealing methods may not provide sufficient adhesion to prevent contamination and mechanical stress.
Innovation Solution
The implementation of a method involving the formation of holes and recesses in the insulating layer, filled with a sealant, enhances the bonding strength between the substrates by increasing the contact area and using a sealant that fills these features, thereby improving the adhesion and protection of the OLED display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional sealing method is used to bond substrates, then the manufacturing process is simple, but the bonding strength between substrates is insufficient
Solution Approach 1:
The patent transitions from a conventional planar sealing interface to a three-dimensional sealing structure by forming holes and recesses in the insulating layer. The sealant is applied to fill these volumetric features, creating bonding interfaces that extend in the vertical dimension rather than relying solely on a flat surface, thereby significantly increasing the effective bonding area and strength.
Solution Approach 2:
The patent intentionally creates a porous or cavitated structure in the insulating layer by forming multiple holes and recesses. These voids are then filled with sealant material, creating a mechanically interlocked bonding structure. The porous configuration increases the surface area for adhesion and provides mechanical anchoring for the sealant, enhancing the overall bonding strength between substrates.
2Area of stationary object
If the sealant is applied only on the surface, then the application process is simple, but the contact area between sealant and substrate is insufficient
Solution Approach 1:
The patent divides the continuous insulating layer into multiple segmented regions by forming discrete holes and recesses. This segmentation creates multiple independent contact zones where sealant can be applied and bonded, effectively multiplying the total contact area between sealant and substrate while maintaining a manageable manufacturing process through standardized hole formation techniques.
Solution Approach 2:
The patent extends the sealant application from a two-dimensional surface layer into the third dimension by filling volumetric holes and recesses. This dimensional transition allows the sealant to contact the substrate at multiple depth levels, dramatically increasing the effective contact area without proportionally increasing the complexity of the application process.
3Reliability
If existing sealing methods are used, then the manufacturing process is straightforward, but the protection against contamination and mechanical stress is insufficient
Solution Approach 1:
The patent employs a porous sealing structure with holes and recesses filled with sealant, creating a mechanically robust bonding interface. This porous configuration provides superior resistance to mechanical stress and contamination compared to conventional flat sealing, as the interlocked structure distributes loads more effectively and creates multiple barriers against contaminant ingress, thereby enhancing overall reliability.
Solution Approach 2:
The patent creates a composite sealing structure combining the insulating layer material with the sealant material in a mechanically interlocked configuration. The combination of these two materials forming holes, recesses, and filled regions creates a composite structure that leverages the advantages of both materials to provide enhanced protection against contamination and mechanical stress, improving reliability without excessive complexity.
Data Source
AI summary
An organic light-emitting diode (OLED) display and method of manufacturing the same are disclosed. In one aspect, the OLED display includes a first substrate including a display area, a display unit formed in the display area and including an insulating layer, and a second substrate formed over the display layer. A sealant material is interposed between the first and second substrates and substantially seals the first and second substrates to each other. At least one hole is formed in a first portion of the insulating layer and at least one recess is formed in a second portion of the insulating layer. The sealant is substantially filled in the hole and the recess.