OLED Sealing Substrate with Carbon Composite for Moisture Barrier
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Solution Overview
Problem
Organic light emitting diode display devices face deterioration when exposed to moisture and oxygen, requiring effective sealing to maintain functionality and image quality.
Innovation Solution
The implementation of a sealing structure using a sealing substrate with inorganic bonding layers and a conductive bonding layer, which includes a hygroscopic filler and a carbon composite material with a low thermal expansion coefficient, to prevent moisture and oxygen ingress while simplifying the manufacturing process and enhancing luminance uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing structure is implemented to prevent moisture and oxygen ingress, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple sealing layers (first sealing layer and second sealing layer) with different material properties into a unified sealing structure. The first sealing layer provides primary sealing while the second sealing layer enhances moisture and oxygen barrier properties, creating a composite sealing system that achieves high reliability without requiring entirely separate sealing mechanisms.
Solution Approach 2:
The invention uses composite material structures where the sealing substrate incorporates both organic sealing materials and inorganic barrier layers. This composite approach allows the sealing structure to simultaneously provide mechanical sealing and chemical barrier functions, improving reliability while managing structural complexity through material integration rather than separate components.
2Productivity
If the display unit area is increased, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent implements a non-display area surrounding the display area where additional sealing structures and bonding layers are concentrated. This local enhancement of sealing quality at the boundaries allows the central display area to maintain high luminance uniformity while the overall device achieves larger area and improved productivity. The sealing substrate extends into the non-display area to provide enhanced edge sealing without interfering with the display region quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively seals the display unit, preventing moisture and oxygen from entering, thus improving the durability and luminance uniformity of the organic light emitting diode display device, while reducing the complexity of the manufacturing process and maintaining thermal expansion compatibility with the substrate.
Implementation Method 1
a first inorganic bonding layer, and a second inorganic bonding layer positioned outside of the first inorganic bonding layer. The first conductive unit is in contact with the first inorganic bonding layer, and the second conductive unit is in contact with the second inorganic bonding layer
Implementation Method 2
a conductive bonding layer which includes a hygroscopic filler
Implementation Method 3
a carbon composite material with a low thermal expansion coefficient
Data Source
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AI summary
An embodiment provides an organic light emitting diode display device that includes a substrate; a display unit formed on the substrate and including a common power supply line and a common electrode; a sealing substrate attached to the substrate by a bonding layer which surrounds the display unit, the sealing substrate including a resin base and a carbon fiber, and the sealing substrate including a first through-hole and a second through-hole; a first conductive unit formed on an inner surface and an outer surface of the sealing substrate through the first through-hole, and the first conductive unit supplying a first signal to the common power supply line; and a second conductive unit formed on both the inner surface and the outer surface of the sealing substrate through the second through-hole, and the second conductive unit supplying a second signal to the common electrode.