Double-Sided OLED Display Substrate Alignment via Segmented FPCB

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Solution Overview

Problem

Double-sided emission type OLED display devices face reliability issues due to the complexity of coupling substrates with bent flexible printed circuit boards, which can lead to film lead cracks and make it difficult to apply heat or pressure for connection, limiting their use in high-resolution and large displays.

Innovation Solution

The use of a flexible printed circuit board that connects substrates without a bent portion, with protruded portions on each substrate allowing for easy alignment and reduced risk of film lead cracks, enhancing the reliability and ease of connection between substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bent flexible printed circuit board is used to couple substrates, then the substrates can be connected, but film lead cracks occur and reliability decreases

Engineering Contradiction:
ImprovereliabilityVSAvoidcomplexity of coupling substrates
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The flexible printed circuit board is divided into multiple rigid segments connected by flexible joints. Each segment can be rigidly coupled to substrate protrusions, while the flexible joints accommodate substrate curvature without creating continuous bent paths that lead to film lead cracks. This segmentation isolates stress concentration points and prevents crack propagation through the entire connection path.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connection structure transitions from a two-dimensional planar FPCB to a three-dimensional configuration where rigid segments are positioned at different heights and orientations. The flexible joints enable the FPCB to conform to the curved substrate surface while maintaining rigid connections at coupling points, effectively adding a dimensional degree of freedom to the connection structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a bent flexible printed circuit board is used to couple substrates, then connection is achieved, but it becomes difficult to apply heat or pressure for connection

Engineering Contradiction:
Improveease of connectionVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The FPCB is segmented into rigid portions that can be independently coupled to substrate protrusions. This segmentation allows heat or pressure to be applied locally at each rigid coupling point without the interference of bent sections. The flexible joints remain separate and do not interfere with the heating or pressing process at the rigid connection locations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the FPCB have different mechanical properties: rigid segments for coupling and flexible joints for conforming. This local differentiation allows specific regions to be optimized for their functions - the rigid segments can receive concentrated heat or pressure for reliable bonding, while the flexible joints maintain their conformability without requiring thermal or mechanical intervention.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If protruded portions are used for substrate connection, then alignment is improved, but device complexity increases

Engineering Contradiction:
Improvealignment precisionVSAvoiddevice complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The substrate edges are segmented into multiple protrusions distributed along the connection interface. This segmentation provides multiple discrete alignment features that can be independently positioned, allowing for precise alignment through a distributed array of simple geometric features rather than complex single-structure alignment mechanisms.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of adding complex alignment structures to the FPCB or substrate, the invention inverts the approach by adding simple protruded portions to the substrates themselves. These protrusions serve as the alignment features, eliminating the need for complex alignment mechanisms on the FPCB side while achieving high precision through the simplicity and distribution of the protrusion features.

Inventive Principle:
Principle #13The other way round (Inversion)

Data Source

PatentUS9182784B2Double-sided emission type display device
Publication Date: 2015.11.10 SAMSUNG DISPLAY CO LTD
  • US9182784B2 patent drawing
  • US9182784B2 patent drawing
  • US9182784B2 patent drawing

AI summary

A double-sided emission type display device includes a first substrate having a first connection and a first protruded portion extending in a first direction; a first display unit at the first substrate; a second substrate coupled to the first substrate, comprising a second connection and a second protruded portion extending in the first direction; a second display unit at the second substrate; and a first flexible printed circuit board (FPCB) including a first connecting portion coupled to the first connection and a second connecting portion coupled to the second connection.