OLED Side Encapsulation with Support Structures
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Solution Overview
Problem
Organic light-emitting display (OLED) devices are prone to degradation due to exposure to oxygen and moisture, leading to reduced brightness and lifespan, and existing encapsulation methods struggle to withstand deformation during the manufacturing process.
Innovation Solution
An OLED device with a side encapsulation structure and reinforcing supports formed from the same materials as the planarization layer and bank structure on the first substrate, and the color layers and black matrix on the second substrate, which maintain spacing and prevent deformation during attachment, enhancing moisture-proof performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation structure is used to protect OLED device from oxygen and moisture, then reliability is improved, but the encapsulation structure is prone to deformation and breakage during manufacturing process
Solution Approach 1:
The encapsulation structure is divided into multiple functional layers: a rigid inorganic encapsulation layer for protection, a flexible organic buffer layer to absorb stress and prevent breakage, and support structures (spacers and reinforcing structures) distributed throughout to provide mechanical strength. This segmentation allows each layer to specialize in one function, resolving the contradiction between protection and vulnerability.
Solution Approach 2:
The encapsulation structure combines inorganic materials (such as silicon oxide, silicon nitride) with organic materials (such as benzocyclobutene, polyimide) to create a composite structure. The inorganic layer provides rigidity and moisture barrier properties, while the organic layer provides flexibility and stress absorption, together achieving both protection and resistance to deformation.
2Stability of the object's composition
If rigid encapsulation structure is used to prevent deformation, then structural stability is improved, but the device becomes more susceptible to breakage under pressure
Solution Approach 1:
The patent changes the mechanical parameters of the encapsulation structure by introducing a multi-layer composition with different elastic moduli. The inorganic layer has high elastic modulus for stability, while the organic layer has low elastic modulus for flexibility. This parameter differentiation allows the structure to maintain shape while absorbing impact energy.
Solution Approach 2:
The flexible organic buffer layer is placed beforehand within the rigid inorganic encapsulation structure to act as a cushion. When external pressure is applied, this buffer layer absorbs the stress before it can propagate through the rigid structure, preventing breakage while maintaining overall structural stability.
3Manufacturing precision
If support structures are added to prevent substrate deformation, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The support structures serve multiple functions: they act as spacers to maintain substrate distance, provide mechanical reinforcement to prevent deformation, and serve as alignment references during manufacturing. By making these structures multi-functional, the patent achieves high manufacturing precision without proportionally increasing complexity.
Solution Approach 2:
The patent merges the support structures with the encapsulation layers themselves rather than adding them as separate components. The inorganic and organic layers are configured to simultaneously provide encapsulation and structural support, combining protective and reinforcing functions into a unified structure.
Data Source
AI summary
Described herein is an organic light-emitting display (OLED) device, comprising: a first substrate comprising an array of pixels; a second substrate facing the first substrate and comprising a color layer corresponding to each pixel in the array of pixels, and comprising a black matrix separating each pixel in the array of pixels from one another; a filler layer between the first substrate and the second substrate; a side encapsulation structure between the first substrate and the second substrate along side edges thereof, wherein the side encapsulation layer is around the filler layer; and a first support on an outer portion of the side encapsulation structure on the first substrate.