Cross-linked Silicone Filler for OLED Encapsulation

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Solution Overview

Problem

Conventional encapsulation substrates for organic light emitting devices are vulnerable to external impact and pressure, and the organic compounds within these devices deteriorate when exposed to moisture and oxygen, leading to degradation.

Innovation Solution

An organic light emitting device is designed with a cross-linked silicone polymer filler, obtained through an addition cure reaction between alkenyl-modified and hydrogen-modified silicone polymers, which is used to seal the device and provide protection from external impacts and moisture, along with a sealing member containing frit materials like K2O and ZnO, and is cured using UV irradiation or heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional encapsulation substrate is used to protect the organic light emitting device, then the device is protected from moisture and oxygen, but the encapsulation substrate is easily damaged by external impact or pressure

Engineering Contradiction:
Improveprotection from moisture and oxygenVSAvoidresistance to external impact or pressure
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining the encapsulation substrate with a filler material that has high resistance to external impact and pressure. This composite structure maintains the moisture and oxygen barrier function of the encapsulation substrate while adding mechanical strength from the filler material, thereby resolving the contradiction between protection from environmental factors and resistance to physical damage.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If the organic compound is exposed to moisture and oxygen, then the device structure remains simple, but the organic compound deteriorates leading to device degradation

Engineering Contradiction:
Improvestructure simplicityVSAvoidorganic compound stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent introduces an intermediary protective layer or coating between the organic compound and the external environment (moisture and oxygen). This intermediary barrier prevents direct contact between the organic compound and harmful environmental factors, maintaining device reliability without significantly increasing structural complexity, as the intermediary layer can be applied as a thin coating or integrated into the existing device architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cross-linked silicone polymer filler enhances the mechanical strength and adhesion of the device, reducing the risk of damage from external forces and improving the overall intensity of the organic light emitting device by providing a robust barrier against moisture and oxygen.

Implementation Method 1

The cross-linked silicone polymer may be obtained by an addition cure reaction of a alkenyl-modified silicone polymer and a hydrogen-modified silicone polymer

Methodology Applied
Scientific EffectAddition cure reaction: Chemical Bonding

Implementation Method 2

The sealing member may be cured by being irradiated with a laser or ultraviolet (UV) ray

Methodology Applied
Scientific EffectUV irradiation curing: Photopolymerisation

Data Source

PatentUS8970102B2Organic light emitting device and filler for sealing the same
Publication Date: 2015.03.03 SAMSUNG DISPLAY CO LTD
  • US8970102B2 patent drawing
  • US8970102B2 patent drawing
  • US8970102B2 patent drawing

AI summary

An organic light emitting device display includes a substrate, an organic light emitting diode array on the substrate, an encapsulation substrate on the organic light emitting diode array, and an internal filler between the organic light emitting diode array and the encapsulation substrate, the internal filler including a cross-linked silicone polymer.