Transparent OLED Substrate with Heat-Dissipating Cavities
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Solution Overview
Problem
Transparent organic light emitting diodes (OLEDs) face rapid aging and inhomogeneities in luminous image due to intrinsic heating, as conventional heat dissipation methods are not applicable for transparent components.
Innovation Solution
An optoelectronic component with a substrate having cavities filled with a second material of higher specific heat capacity than the substrate material, allowing for effective heat dissipation while maintaining transparency, using materials like glycerol or air to enhance heat dissipation without compromising light transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods (metal films, graphite) are used, then heat dissipation performance is improved, but transparency is lost
Solution Approach 1:
The substrate is divided into multiple regions with different materials: a first substrate material forming the base structure and maintaining transparency, and a second substrate material forming cavities or regions specifically designed for heat dissipation. This segmentation allows each region to perform its specialized function without compromising the other.
Solution Approach 2:
Different regions of the substrate are assigned different material properties: the first substrate material is optimized for transparency and structural support, while the second substrate material is optimized for thermal conductivity and heat dissipation. This local differentiation resolves the contradiction by providing heat dissipation only where needed while preserving overall transparency.
2Illumination intensity
If transparent OLEDs are used, then transparency is maintained, but heat dissipation capability deteriorates
Solution Approach 1:
The substrate structure is segmented into heat-dissipating regions (second substrate material) and transparent regions (first substrate material), allowing the transparent OLED to maintain its transparency while incorporating dedicated heat dissipation pathways through the segmented substrate architecture.
Solution Approach 2:
The second substrate material acts as an intermediary heat dissipation medium embedded within the transparent substrate. It mediates between the heat-generating OLED and the surrounding environment, providing efficient heat transfer while the first substrate material maintains the overall transparency of the device.
3Ease of manufacture
If uniform substrate material is used, then manufacturing simplicity is maintained, but heat distribution uniformity deteriorates
Solution Approach 1:
The substrate is segmented into different material regions to achieve uniform heat distribution. The second substrate material is strategically positioned in cavities or specific regions to create uniform heat dissipation across the OLED active area, preventing hot spots while maintaining manufacturability through structured fabrication processes.
Solution Approach 2:
Local regions of the substrate are modified with second substrate material to create optimal heat distribution. This localized modification ensures uniform heat dissipation across the device area while the overall manufacturing process remains relatively simple and scalable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and long-term optoelectronic component with improved heat dissipation and uniform light emission, addressing the issue of rapid aging and inhomogeneities in transparent OLEDs.
Implementation Method 1
The second substrate material is designed to dissipate the heat emitted by the organic light emitting diode
Implementation Method 2
the organic light emitting diode is designed for emitting radiation
Implementation Method 3
During the operation of organic light emitting diodes (OLEDs), intrinsic heating generally takes place
Data Source
AI summary
The invention relates to an optoelectronic component (100) comprising an organic light emitting diode (1) designed for emitting radiation and/or heat, a substrate (2), on which the organic light emitting diode is arranged, wherein the substrate (2) comprises a first substrate material (21) and at least one substrate cavity (22) which is filled with a second substrate material (23) different than the first substrate material (21), wherein the second substrate material (23) is designed to dissipate the heat emitted by the organic light emitting diode (1).


