OLED Display Substrate Encapsulation Without Masking
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Solution Overview
Problem
The existing thin film encapsulation processes for OLED display devices require the use of a mask during chemical vapor deposition, increasing production costs and complexity due to the need for precise masking to form inorganic encapsulation layers, which is not efficient for the bonding pad areas.
Innovation Solution
A manufacturing method for a display substrate that forms a first inorganic encapsulation layer on the entire surface, followed by an organic encapsulation layer, and a second inorganic encapsulation layer, with the inorganic encapsulation layer in the bonding pad area being removed, allowing for cost-effective formation without the need for masking, and incorporating touch metal layers and capping layers for enhanced protection and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is used during chemical vapor deposition to form the inorganic encapsulation layer in a local area, then the encapsulation precision is improved, but the device complexity and production cost increase
Solution Approach 1:
The substrate is divided into display area and bonding area, with different encapsulation strategies applied to each region. The display area receives full encapsulation while the bonding area remains exposed, eliminating the need for masking during deposition.
Solution Approach 2:
Different regions of the substrate are given different encapsulation properties: the display area is fully encapsulated with inorganic and organic layers for protection, while the bonding area is left unencapsulated to allow external connection, achieving local optimization of encapsulation quality.
2Manufacturing precision
If a mask is used during chemical vapor deposition to form the inorganic encapsulation layer in a local area, then the encapsulation precision is improved, but the production cost increases
Solution Approach 1:
The substrate is divided into display area and bonding area, with different encapsulation strategies applied to each region. The display area receives full encapsulation while the bonding area remains exposed, eliminating the need for masking during deposition.
Solution Approach 2:
Different regions of the substrate are given different encapsulation properties: the display area is fully encapsulated with inorganic and organic layers for protection, while the bonding area is left unencapsulated to allow external connection, achieving local optimization of encapsulation quality.
3Productivity
If the inorganic encapsulation layer is formed on the entire surface, then the productivity is improved, but the bonding pad area becomes inaccessible for external connection
Solution Approach 1:
The substrate is divided into display area and bonding area, with different encapsulation strategies applied to each region. The display area receives full encapsulation while the bonding area remains exposed, eliminating the need for masking during deposition.
Solution Approach 2:
Different regions of the substrate are given different encapsulation properties: the display area is fully encapsulated with inorganic and organic layers for protection, while the bonding area is left unencapsulated to allow external connection, achieving local optimization of encapsulation quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces production costs by eliminating the need for masking during inorganic encapsulation layer formation, while ensuring effective encapsulation and protection of the OLED elements, enhancing the reliability and efficiency of the display substrate manufacturing process.
Implementation Method 1
The inorganic encapsulation layer is formed by chemical vapor deposition in the manufacturing process
Data Source
AI summary
A manufacturing method for a display substrate, a display substrate and a display device are provided. The display substrate includes a display area and a bonding area at one side of the display area. The bonding area includes an isolation area disposed close to the display area and a bonding pad area disposed at one side of the isolation area far away from the display area. The manufacturing method of the display substrate includes forming a driving structure layer in the display area of a substrate and a bonding structure layer in the bonding area of the substrate, forming a light emitting structure layer on the driving structure layer of the display area, forming an isolation dam on the bonding structure layer of the isolation area, forming an encapsulation structure layer in the display area.


