OLED Array Substrate Connection Structure for Signal Line Inspection
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Solution Overview
Problem
In the manufacturing process of OLED display panels, the existing method of forming source/drain-layer power supply lines in a short circuit state with gate-layer power supply lines makes it difficult to detect and repair abnormalities, such as short circuits or open circuits, in these lines, leading to reduced yield and increased production costs.
Innovation Solution
The array substrate is designed with a conductive mesh structure formed by overlapping first and second signal lines in different layers, connected through via holes, allowing for timely detection and repair of signal line abnormalities by preventing direct short-circuit connections between the layers, and including a method for forming and inspecting the signal lines before completing the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If source/drain-layer power supply lines are formed in direct contact with gate-layer power supply lines, then manufacturing process is simplified, but it becomes difficult to detect and repair abnormalities such as short circuits or open circuits
Solution Approach 1:
The patent introduces a connection structure with connection parts and via holes as intermediaries between the source/drain-layer power supply lines and gate-layer power supply lines. This intermediary structure allows the lines to be electrically connected while enabling detection and repair capabilities, as the connection parts can be independently accessed and tested without direct contact between the power supply lines themselves.
Solution Approach 2:
The patent divides the direct connection between power supply lines into separate segments: the first connection part in the second conductive layer, the via holes through the insulating layer, and the second connection part in the third conductive layer. This segmentation allows for independent detection and repair of each segment, solving the problem of abnormality detection while maintaining electrical connection.
2Device complexity
If direct short-circuit connections are made between signal lines in different layers, then device complexity is reduced, but yield decreases due to inability to detect and repair abnormalities
Solution Approach 1:
The connection structure serves as an intermediary that maintains electrical connection between layers while enabling detection and repair. The connection parts and via holes allow abnormalities to be detected without requiring complex additional structures, thus maintaining relatively simple device complexity while improving yield through enhanced detectability and repairability.
Solution Approach 2:
The patent implements detection and repair capabilities before the display panel is completed and shipped. By incorporating detectable connection structures during the manufacturing process, abnormalities can be identified and repaired preliminarily, preventing defective products from reaching customers and thereby improving overall manufacturing yield.
3Difficulty of detecting and measuring
If connection structures with via holes are used to connect signal lines in different layers, then abnormality detection and repair become possible, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses via holes that extend in the vertical dimension through the insulating layer to connect different horizontal layers. This dimensional approach allows electrical connection and detection capability without requiring high precision in lateral alignment, as the via holes can accommodate reasonable variations in positioning while maintaining functional connection between the connection parts.
Data Source
AI summary
An array substrate and a display panel are provided. The array substrate includes a base substrate and a first conductive layer, a first insulating layer, a second conductive layer and a third conductive layer which are sequentially stacked on the base substrate, the first insulating layer insulates the first conductive layer from the second conductive layer, the first conductive layer includes a first signal line, the second conductive layer includes a second signal line and a first connection part spaced apart from each other, the third conductive layer includes a second connection part, the first connection part is electrically connected with the first signal line through a first via hole in the first insulating layer; the second connection part is electrically connected with the first connection part and the second signal line to constitute a connection structure electrically connecting the first signal line with the second signal line.