OLED Display Substrate Routing to Mitigate Frit-Glue Shrinkage
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Solution Overview
Problem
The encapsulation of OLED display devices using frit glue and an encapsulation cover plate is inadequate in preventing moisture and oxygen ingress, leading to corrosion and reduced service life due to shrinkage of the frit glue during laser sintering, which compromises the encapsulation effect.
Innovation Solution
A display substrate design with specific power source line configurations and additional features such as fanout lines, dummy signal lines, and encapsulation basal layers to enhance adhesion and reduce flatness, ensuring effective encapsulation without additional film layers or process improvements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If frit glue and encapsulation cover plate are used to protect the display device from moisture and oxygen, then the display device is encapsulated, but the frit glue shrinks during laser sintering which compromises the encapsulation effect
Solution Approach 1:
The patent changes the geometric parameters of the power source lines by introducing bent structures with specific curvature radii and angle ranges. The power source lines include first bent portions with curvature radius (50-200) μm and second bent portions with curvature radius (20-100) μm, forming angles between 45-135 degrees. This geometric parameter optimization prevents direct alignment with laser sintering paths, reducing frit glue shrinkage and maintaining encapsulation integrity.
Solution Approach 2:
The patent introduces fanout lines as intermediary structures between the power source lines and the display region. These fanout lines with specific width ranges (50-200) μm serve as mediators that distribute power while their geometric configuration further prevents direct laser sintering paths, adding an additional layer of protection against frit glue shrinkage.
2Ease of manufacture
If the power source lines are arranged to provide power to the display region, then power supply is enabled, but the lines may align with laser sintering paths causing encapsulation failure
Solution Approach 1:
The patent employs asymmetric bent configurations in the power source lines, where the first bent portions and second bent portions have different curvature radii and are positioned at specific angles. This asymmetric design ensures that the power source lines do not follow straight paths that would align with laser sintering directions, thereby preventing encapsulation failure while maintaining power supply functionality.
Solution Approach 2:
The patent transitions from linear power source line arrangements to multi-dimensional bent configurations. By introducing angular deviations and varying curvature radii in different directions, the power source lines are repositioned in a multi-dimensional space to avoid collision with laser sintering paths, solving the alignment problem while preserving electrical connectivity.
3Reliability
If additional film layers are added to improve encapsulation, then moisture and oxygen protection is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent makes the existing power source lines and fanout lines serve dual functions: both power supply and encapsulation support. By optimizing the geometric parameters of these existing structures (bent portions with specific curvature radii and angles), they automatically prevent frit glue shrinkage during laser sintering without requiring additional film layers, achieving self-service protection.
Solution Approach 2:
The patent enhances the multi-functionality of the power source lines and fanout lines by having them simultaneously serve as power supply conduits and as structural elements that prevent encapsulation failure. The bent configurations with optimized curvature radii and angles provide both electrical connectivity and mechanical protection against laser sintering-induced shrinkage, eliminating the need for separate protective film layers.
Data Source
AI summary
A display substrate, a manufacturing method and a display device. In the display substrate, a first power source line includes a transmission portion and a first inlet portion coupled to the transmission portion, the transmission portion is arranged between a display region and the first inlet portion and extends in a first direction, and at least a part of the first inlet portion extends in a second direction. A second power source line includes a peripheral portion and two second inlet portions, the peripheral portion surrounds the display region and is provided with an opening, and two ends of the peripheral portion at the opening are coupled to the two second inlet portions respectively. The first inlet portion is arranged between the two second inlet portions, a first spacing region and a second spacing region are arranged between each second inlet portion and the first inlet portion, the first spacing region has a first distance in the first direction, the second spacing region has a second distance in the first direction, the first spacing region overlaps the encapsulation adhesive region at a first overlapping region, the second spacing region does not overlap the encapsulation adhesive region, and the first distance is greater than the second distance.


