OLED Substrate Protective Layer for Laser Cutting Integrity
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Solution Overview
Problem
Current OLED display technologies face challenges in removing light-emitting functional layers near cameras without causing warping or cracking of inorganic layers, leading to packaging reliability issues and reduced display quality due to laser cutting processes.
Innovation Solution
An OLED display substrate with a protective layer made of amorphous indium zinc oxide material is introduced, which is strategically placed to prevent damage to the inorganic layer during laser cutting, ensuring the layer's integrity and maintaining high light transmittance for camera functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If laser cutting is used to remove light-emitting structure in camera region, then light transmittance for camera is improved, but inorganic layer warping or cracking occurs
Solution Approach 1:
A protective layer is introduced as an intermediary element between the laser cutting process and the inorganic layer. This protective layer absorbs the laser energy and prevents direct interaction with the inorganic layer, thereby maintaining light transmittance while preventing warping and cracking of the inorganic layer during the cutting process.
Solution Approach 2:
The protective layer is formed in advance before the laser cutting process. This preliminary action prepares the structure to withstand the upcoming laser cutting by providing a sacrificial layer that will protect the inorganic layer from thermal damage and mechanical stress during the cutting operation.
2Reliability
If protective layer is added to prevent inorganic layer damage, then packaging reliability is improved, but device structure complexity increases
Solution Approach 1:
The protective layer serves multiple functions simultaneously: it protects the inorganic layer from laser-induced damage, maintains structural integrity during manufacturing, and does not interfere with camera light transmittance. By consolidating these functions into a single layer, the design avoids additional complexity while achieving multiple protective goals.
Solution Approach 2:
The protective layer is designed with specific material parameters (amorphous indium zinc oxide) and thickness parameters that optimize its protective function while minimizing its impact on overall device complexity. The material properties are selected to provide adequate protection without requiring additional complex structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer effectively prevents warping and cracking of the inorganic layer during laser cutting, enhancing packaging reliability and display quality by maintaining the structural integrity and optical performance of the OLED display substrate.
Implementation Method 1
removing a part of the light-emitting structure in the orthographic projection region by laser cutting
Implementation Method 2
the protective layer is made of an amorphous indium zinc oxide material
Data Source
AI summary
The present disclosure provides an OLED display substrate, a fabricating method thereof and a display device. The OLED display substrate includes a substrate; an inorganic layer and a light-emitting unit on substrate, light-emitting unit being on a side of inorganic layer away from substrate and including a light-emitting structure; a camera on a side of substrate away from inorganic layer, and light-emitting unit being not in orthographic projection region; a protective layer in orthographic projection region and on side of inorganic layer away from substrate, wherein protective layer is configured to protect inorganic layer in orthographic projection region from warping or cracking in a process of removing part of light-emitting structure in orthographic projection region by laser cutting.