OLED Substrate Microstructure Release Layer Light Out-Coupling
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Solution Overview
Problem
The efficiency of light out-coupling in OLED illuminations is low, with only about 20% usable luminance due to inadequate external and internal light out-coupling, necessitating improvements in substrate modes and surface plasmon modes.
Innovation Solution
A substrate structure is fabricated with a release layer and a flexible substrate, where the release layer has a microstructure and is adhered to a supporting carrier, and the flexible substrate covers the release layer with a larger area, allowing for easy separation and integration of microstructures without external light out-coupling films, enhancing light out-coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional substrate structure is used without microstructures, then the fabrication process is simple, but the light out-coupling efficiency is low (only about 20% usable luminance)
Solution Approach 1:
The patent combines the light out-coupling microstructure function with the release layer that is already part of the flexible substrate structure. The release layer serves dual purposes: enabling easy separation of the flexible substrate from the supporting carrier during fabrication, and providing the microstructure pattern on its first surface to enhance light out-coupling efficiency. This merging eliminates the need for separate external light out-coupling films while maintaining fabrication simplicity.
Solution Approach 2:
The release layer is designed to perform multiple functions simultaneously: (1) acting as a release agent allowing easy separation between the flexible substrate and supporting carrier, (2) providing the microstructure pattern for light out-coupling enhancement, and (3) serving as part of the final substrate structure. This multi-functionality resolves the contradiction by integrating the light out-coupling function into an existing component rather than adding separate elements.
2Loss of energy
If additional external light out-coupling films are attached to improve light out-coupling, then light out-coupling efficiency improves, but the device structure becomes more complex
Solution Approach 1:
Instead of attaching separate external light out-coupling films, the patent merges the light out-coupling microstructure directly into the release layer. The first surface of the release layer contains the microstructure pattern that enhances light out-coupling, eliminating the need for additional external films and maintaining structural simplicity while improving light out-coupling efficiency.
3Ease of operation
If the flexible substrate area is made larger than the release layer area, then the flexible substrate can be easily separated from the supporting carrier, but the adhesion requirement becomes more critical
Solution Approach 1:
The patent applies different adhesion characteristics to different regions: the release layer has controlled adhesion to the supporting carrier allowing easy separation, while the flexible substrate has sufficient adhesion to the release layer to maintain structural integrity during fabrication. The second adhesion between the flexible substrate and release layer is designed to be sufficient for fabrication processes but allow clean separation afterward, resolving the contradiction between ease of separation and adhesion reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves light out-coupling efficiency without additional external films, ensuring the flexible substrate and release layer separate easily, facilitating further fabrication and maintaining structural integrity during the process, thereby enhancing the performance of OLEDs.
Implementation Method 1
the release layer has first adhesion to the supporting carrier
Implementation Method 2
the flexible substrate has second adhesion to the release layer
Implementation Method 3
the first surface area has a first microstructure... to significantly improve the luminances of OLEDs by the improvements in the external light out-coupling of substrate modes
Data Source
AI summary
The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.