OLED Package Substrate Spacer Adhesion via Organic Interlayer
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Solution Overview
Problem
The existing OLED display substrates face issues with spacer peeling due to poor adhesion on metal electrodes, leading to potential defects in the organic package layer and affecting the display performance.
Innovation Solution
A package substrate with a base substrate having light-transmitting and non-light-transmitting regions, where metal electrodes and spacers are positioned such that their orthogonal projections are within specific regions, ensuring an interval between them, and using a planarization layer or transition layer to enhance adhesion, preventing spacer peeling and improving display efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spacers are directly formed on metal electrodes, then the manufacturing process is simple, but the adhesion is poor causing spacer peeling
Solution Approach 1:
The patent introduces an organic package layer as an intermediary between the metal electrode and the spacer. This organic layer serves as a mediator that provides both adhesion to the metal surface and compatibility with the spacer material, thereby preventing spacer peeling while maintaining manufacturing simplicity. The organic package layer is formed by coating organic material on the metal electrode surface, creating a stable interface that resolves the adhesion problem.
2Reliability
If the orthogonal projection of metal electrode overlaps with light-transmitting region, then electrical connection is achieved, but light transmission is blocked causing display defects
Solution Approach 1:
The patent resolves the conflict between electrical connection and light transmission by changing the spatial dimension of the metal electrode. Instead of placing metal electrodes in the light-transmitting region (2D plane conflict), the electrodes are positioned in the non-light-transmitting region, and electrical connection is achieved through vertical conductive pathways (via holes) in the third dimension. This dimensional separation allows both functions to coexist without interference.
3Area of stationary object
If spacer is formed covering entire metal electrode surface, then coverage is complete, but adhesion uniformity is poor leading to peeling
Solution Approach 1:
The patent applies local quality by making the organic package layer's thickness and composition vary across different regions. The organic material is coated to provide optimal adhesion properties at each location, with potentially different thicknesses or material compositions tailored to local requirements. This localized optimization ensures uniform adhesion across the entire metal electrode surface, preventing peeling while maintaining complete coverage.
Data Source
AI summary
A package substrate includes a base substrate having a light-transmitting region and a non-light-transmitting region, wherein metal electrodes and a spacer located on at least a part of a surface of the metal electrodes away from the base substrate are provided on the base substrate, an orthogonal projection of the spacer on the base substrate is within an orthogonal projection of the metal electrodes on the base substrate, and an orthogonal projection of the metal electrode on the base substrate is within the non-light-transmitting region of the base substrate, and an interval exists between the spacer and the metal electrodes. A method of manufacturing the package substrate is used for manufacturing the above package substrate. The package substrate provided by the present disclosure is used in a display device.