OLED Array Substrate Via Layout for ESD-Resistant Gate Connections
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Solution Overview
Problem
Large-sized organic light emitting diode display devices face challenges with electrostatic discharge and electrical connection issues due to the presence of multiple metal layers, which are sensitive to static electricity.
Innovation Solution
The array substrate design includes a base substrate with gate lines connected through a gate driving structure via an interconnecting structure, featuring first and second connecting portions and via holes, enhancing electrical connectivity and reducing electrostatic discharge risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple metal layers are used in large-sized OLED display devices, then electrical connection effectiveness is improved, but electrostatic discharge risk increases
Solution Approach 1:
The gate line is divided into multiple segments (first gate line segment, second gate line segment, third gate line segment) that are electrically connected through via holes. This segmentation allows the gate line to maintain electrical continuity while reducing the risk of electrostatic discharge by breaking the continuous metal path into discrete segments.
Solution Approach 2:
Via holes are introduced as intermediary structures to connect different gate line segments. These via holes act as mediators that maintain electrical connection while providing isolation points that reduce electrostatic discharge risk. The insulating layer surrounding the via holes further enhances this protective function.
2Area of stationary object
If gate lines are extended to cover large display areas, then display size is increased, but electrical connection stability deteriorates
Solution Approach 1:
The gate line is divided into multiple segments positioned at different locations (first, second, and third segments) that are electrically connected through via holes. This segmentation allows the gate line to extend over large display areas while maintaining electrical connection stability through distributed connection points.
Solution Approach 2:
The gate line structure transitions from a two-dimensional planar configuration to a three-dimensional structure by introducing via holes that extend vertically through insulating layers. This dimensional change allows electrical connections to be established at multiple vertical levels, enhancing connection stability across large display areas.
3Reliability
If via holes are introduced to connect gate line segments, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The gate line is segmented into discrete portions that are connected through via holes. While this improves electrical connectivity, it does increase manufacturing complexity by requiring additional patterning and etching steps to create the via holes and insulating layer structures.
Solution Approach 2:
The via holes serve multiple functions: they provide electrical connection between gate line segments, act as anchors for the insulating layer, and provide structural support. This multi-functionality justifies the additional manufacturing complexity by consolidating multiple requirements into a single structural element.
Data Source
AI summary
An array substrate and a display device are provided. The array substrate includes a base substrate, and gate lines, a gate driving structure, an interconnecting structure and an insulating layer. The gate lines are electrically connected with the gate driving structure through the interconnecting structure; the insulating layer is located between the gate lines and the interconnecting structure, and includes a first via hole and a second via hole. The gate line includes a first connecting portion and a second connecting portion, and the second connecting portion is located between the gate driving structure and the first connecting portion; the first connecting portion is electrically connected with the interconnecting structure through the first via hole, and a straight line extending in a direction perpendicular to the base substrate passes through the second connecting portion, the second via hole and the interconnecting structure in turn.