OLED Supporting Plate Thermal Dissipation and Circuit Stability
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Solution Overview
Problem
Organic electroluminescent devices (OLEDs) face challenges with overheating and unstable attachment of external circuits, particularly in top emission types, which affect brightness and reliability due to heat dissipation issues and detachment during impact tests.
Innovation Solution
Incorporating a supporting plate with better thermal conductivity than the substrate between the substrate and the printed circuit board, along with an auxiliary supporting plate for additional structural support, to enhance heat dissipation and stabilize the external circuit attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a top emission type OLED is used to improve brightness in the transmissive region, then light emission is transmitted in the top direction away from opaque metal lines, but heat dissipation becomes insufficient causing overheating
Solution Approach 1:
The supporting plate is segmented into a first supporting plate attached to the substrate and a second supporting plate attached to the PCB, connected through a connection portion. This segmentation allows each part to fulfill specific functions: the first supporting plate provides thermal management for the OLED, while the second supporting plate ensures stable PCB attachment, resolving the contradiction between brightness improvement and heat dissipation capability
Solution Approach 2:
The supporting plate structure acts as an intermediary between the substrate and PCB, providing a thermal conduction path that mediates heat transfer from the OLED to the PCB. This intermediary structure enables effective heat dissipation without compromising the top emission brightness improvement
2Ease of operation
If the PCB is directly attached to the substrate to supply external signals, then electrical connection is established, but the attachment becomes unstable causing detachment during impact tests
Solution Approach 1:
The supporting structure is divided into multiple functional parts: the first supporting plate for substrate attachment, the second supporting plate for PCB attachment, and a connection portion linking them. This segmentation provides both mechanical stability for reliable attachment and electrical connectivity through the pad and TCP structure
Solution Approach 2:
The supporting plate extends in multiple dimensions, with the first supporting plate attached to the substrate back surface and the second supporting plate extending to contact the PCB. This dimensional extension provides stable mechanical attachment while maintaining electrical connection pathways
3Ease of operation
If the TCP is bent to connect the pad and PCB, then electrical connection is achieved, but the bent structure is vulnerable to detachment during impact tests
Solution Approach 1:
The supporting plate structure provides beforehand cushioning and mechanical support to the TCP connection. The second supporting plate attached to the PCB back surface creates a stable mounting structure that cushions the bent TCP from mechanical stress during impact tests, preventing detachment while maintaining electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents overheating and improves the stability of the OLED by effectively dissipating heat and securely affixing the external circuit, leading to enhanced operating characteristics and reduced failures.
Implementation Method 1
a supporting plate between the substrate and the printed circuit board, the supporting plate having a better thermal conductivity than the substrate
Data Source
AI summary
An organic electroluminescent device includes: an array element layer having a pad on a first substrate having first and second sides; an organic electroluminescent diode connected to the array element, the organic electroluminescent diode emitting light in an opposite direction away from the first substrate; a printed circuit board adjacent to a backside of the first substrate, the printed circuit board supplying the array element with external signals through the pad; and a supporting plate between the first substrate and the printed circuit board, the supporting plate having better thermal conductivity than the first substrate.