OLED Package Test Lead Thermal Conductivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the manufacturing process of OLED display panels, the low thermal conductivity of materials used in package test leads can lead to heat accumulation, causing organic material layers to burn and peel off during the aging process, affecting display quality due to electric leakage and tail-hanging phenomena.
Innovation Solution
The use of package test leads with higher thermal conductivity than the signal lines, made from materials like gold, silver, copper, aluminum, or their alloys, to effectively dissipate heat and prevent organic material damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If package test leads are made with conventional materials (same as signal lines), then manufacturing cost is reduced and ease of manufacture is improved, but thermal conductivity is insufficient causing heat accumulation and organic material damage
Solution Approach 1:
The patent applies different material properties to different parts of the same structure. Specifically, the package test lead is made with high thermal conductivity material (such as molybdenum, tungsten, or their alloys) while the signal line uses conventional materials. This local differentiation ensures that the package test lead can effectively dissipate heat during aging processes without requiring all conductive elements to use expensive high-thermal-conductivity materials, thus resolving the contradiction between heat dissipation capability and manufacturing complexity.
Solution Approach 2:
The patent employs composite material structures where the package test lead is constructed from materials with superior thermal conductivity properties compared to conventional signal line materials. The use of composite materials (such as molybdenum-based or tungsten-based alloys) allows the package test lead to achieve both high thermal conductivity for heat dissipation and compatibility with existing manufacturing processes, thereby balancing thermal performance requirements with manufacturing ease.
2Reliability
If package test leads use high thermal conductivity materials, then heat dissipation is improved preventing organic material burning, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent applies different material properties to different parts of the same structure. Specifically, the package test lead is made with high thermal conductivity material (such as molybdenum, tungsten, or their alloys) while the signal line uses conventional materials. This local differentiation ensures that the package test lead can effectively dissipate heat during aging processes without requiring all conductive elements to use expensive high-thermal-conductivity materials, thus resolving the contradiction between heat dissipation capability and manufacturing complexity.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the package test lead material to a higher value compared to conventional signal line materials. By selecting materials with specific thermal conductivity ranges (such as molybdenum with 138-150 W/(m·K) or tungsten with 140-170 W/(m·K)), the patent optimizes heat dissipation performance to prevent organic material damage during aging, while managing the associated increase in device complexity through controlled material selection.
3Ease of manufacture
If package test leads are made with conventional materials, then ease of manufacture is improved, but heat accumulation causes organic material layers to burn and peel off during aging
Solution Approach 1:
The patent applies different material properties to different parts of the same structure. Specifically, the package test lead is made with high thermal conductivity material (such as molybdenum, tungsten, or their alloys) while the signal line uses conventional materials. This local differentiation ensures that the package test lead can effectively dissipate heat during aging processes without requiring all conductive elements to use expensive high-thermal-conductivity materials, thus resolving the contradiction between heat dissipation capability and manufacturing complexity.
Solution Approach 2:
The patent converts the potentially harmful effect of heat generation during aging processes into a beneficial outcome by selecting materials with high thermal conductivity. The high thermal conductivity materials in the package test lead actively channel and dissipate the heat generated during aging, transforming what would be a harmful heat accumulation effect into a controlled thermal management solution that protects organic material layers from burning and peeling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents the burning and peeling of organic material layers by ensuring efficient heat dissipation, thereby improving the display quality and reducing defects in OLED panels.
Implementation Method 1
a thermal conductivity of the first package test lead is higher than a thermal conductivity of the first signal line
Data Source
AI summary
An organic light emitting diode array substrate and an electronic device. The organic light emitting diode array substrate includes a display region, and a first package test electrode and a first package test lead which are outside the display region. The display region includes a first power supply line and a first signal line; the first package test lead is configured to connect the first package test electrode with the first power supply line to provide a first supply voltage for the display region; the first signal line is configured to provide a first electrical signal for the display region; and a thermal conductivity of the first package test lead is higher than a thermal conductivity of the first signal line.