OLED Display Substrate Test Line Layout for Burn-Free Aging

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Solution Overview

Problem

The aging process for flexible OLED display panels faces challenges in balancing the reduction of characteristic highlights and the risk of burns during high-voltage thermal treatment, which affects the product yield due to the limitations of organic film layers and conductive film deposition processes.

Innovation Solution

A display substrate design that includes a base substrate with sub-pixels, data lines, a test circuit, data leads, test pads, and first test signal lines with multiple conductive layers connected in parallel, reducing wiring resistance and heat generation, thereby mitigating the risk of burns during the aging process and improving yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If high-voltage thermal treatment is applied during aging process, then characteristic highlights are reduced, but risk of burns increases

Engineering Contradiction:
Improvecharacteristic highlights reductionVSAvoidburns risk
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The first test signal line is segmented into multiple conductive layers (first, second, and third conductive layers) stacked vertically. This segmentation distributes the current density across multiple layers, reducing heat generation in any single layer during high-voltage thermal treatment, thereby reducing burns risk while maintaining the ability to reduce characteristic highlights through controlled thermal aging.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a planar single-layer conductive structure to a three-dimensional multi-layer stacked structure. By adding the vertical dimension with multiple conductive layers connected in parallel, the current distribution is improved and heat generation is reduced, allowing high-voltage thermal treatment to proceed with lower burns risk while still achieving characteristic highlights reduction.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If single conductive layer is used in test signal line, then manufacturing is simpler, but wiring resistance is higher and heat generation increases

Engineering Contradiction:
Improveconductive layer structure simplicityVSAvoidwiring resistance and heat generation
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The conductive path is segmented into multiple parallel conductive layers instead of a single thick layer. This segmentation reduces the resistance by providing multiple parallel current paths and reduces heat generation by distributing the current density, improving reliability without significantly complicating the manufacturing process as the layers are formed using standard multi-layer deposition techniques.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The test signal line uses a composite structure with multiple conductive layers (different materials or configurations) stacked together. This composite approach reduces overall resistance and heat generation by combining the advantages of different conductive layers in parallel, improving reliability while remaining compatible with existing manufacturing processes.

Inventive Principle:
Principle #40Composite materials

3Reliability

If multiple conductive layers are used in parallel, then wiring resistance decreases and heat dissipation improves, but device complexity increases

Engineering Contradiction:
Improvewiring resistance and heat dissipationVSAvoidconductive layer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive path is divided into multiple parallel layers, which reduces resistance and improves heat dissipation. The segmentation is implemented in a systematic way using standard multi-layer fabrication processes, so while the structure is more complex, the manufacturing complexity is managed through established techniques rather than requiring entirely new processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent moves from a two-dimensional planar conductive structure to a three-dimensional multi-layer structure. This dimensional change provides better current distribution and heat dissipation by utilizing the vertical space, improving reliability. The added complexity is offset by the efficiency gains in resistance and thermal management.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The parallel conductive layers in the display substrate reduce heat generation and enhance heat dissipation, effectively addressing the issue of burns during the aging process and improving the product yield of flexible OLED display panels.

Implementation Method 1

At least part of the at least one first test signal line includes at least two conductive layers connected in parallel and electrically connected to each other

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

reducing wiring resistance and heat generation, thereby mitigating the risk of burns during the aging process

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 3

The parallel conductive layers in the display substrate reduce heat generation and enhance heat dissipation, effectively addressing the issue of burns during the aging process

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12256611B2Display substrate and display device
Publication Date: 2025.03.18 CHENGDU BOE OPTOELECTRONICS TECH CO LTD
  • US12256611B2 patent drawing
  • US12256611B2 patent drawing
  • US12256611B2 patent drawing

AI summary

A display substrate and a display device are provided. The display substrate includes a base substrate, multiple sub-pixels, multiple data lines, a test circuit, multiple data leads, at least one test pad, and at least one first test signal line. The multiple data lines are electrically connected to the multiple sub-pixels, and configured to provide data signals to the multiple sub-pixels. The multiple data leads are electrically connected to the multiple data lines and the test circuit. At least one test pad is located on at least one side of the test circuit. The at least one first test signal line is electrically connected to at least one test pad and the test circuit, and includes at least two conductive layers connected in parallel and electrically connected to each other.