OLED TFE Multi-Layer Structure Wrapping Foreign Matter
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Solution Overview
Problem
Current thin film encapsulation (TFE) technology for OLED devices has a low protection ability against water and oxygen ingress, particularly due to foreign matters generated during manufacturing, which leads to performance failures.
Innovation Solution
A multi-layered organic light emitting diode (OLED) package structure is proposed, comprising a gate insulating layer, barrier layers, organic buffer layers, and hydrophobic layers with nano microstructures, which are sequentially deposited to enhance protection against water and oxygen ingress by effectively wrapping foreign matters and limiting their entry into the OLED device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a simple thin film encapsulation structure is used, then the device structure remains simple and manufacturing is easier, but the protection ability against water and oxygen ingress is insufficient
Solution Approach 1:
The encapsulation structure is divided into multiple functional layers including barrier layers, organic buffer layers, and hydrophobic layers with nano microstructures. Each layer performs a specific function in preventing water and oxygen ingress, transforming a single protective function into multiple coordinated protective mechanisms.
Solution Approach 2:
The patent employs composite material structures combining inorganic barrier layers with organic buffer layers and hydrophobic coatings. This composite approach leverages the complementary properties of different materials to achieve superior protection against moisture and oxygen while maintaining structural integrity.
2Reliability
If foreign matters are not addressed during manufacturing, then the manufacturing process is simpler, but water and oxygen can enter the OLED device through the second route causing failure
Solution Approach 1:
The organic buffer layers are deposited beforehand to cover and encapsulate foreign matters that may be present on the substrate or previous layers. This preliminary protective action ensures that any contaminants generated during manufacturing are sealed off before they can create pathways for water and oxygen ingress.
Solution Approach 2:
Instead of requiring perfectly clean manufacturing conditions, the patent transforms the presence of foreign matters into a manageable situation by using the organic buffer layers to encapsulate them. The foreign matters become trapped within the multi-layer structure, converting a potential failure source into a contained element that no longer threatens device reliability.
3Adaptability or versatility
If the TFE film layer is made thinner to achieve flexible bending properties, then flexibility is improved, but the barrier performance against water and oxygen penetration is reduced
Solution Approach 1:
The patent employs thin film encapsulation with organic buffer layers that provide both flexibility and protective functionality. The thin film structure maintains the flexible bending properties required for flexible OLED devices while the multi-layer configuration enhances the barrier performance against water and oxygen penetration.
Solution Approach 2:
The patent changes the physical and chemical parameters of the encapsulation layers by introducing hydrophobic layers with nano microstructures and adjusting the composition of organic buffer layers. These parameter changes enhance the barrier properties of thin films without compromising their flexibility, allowing the device to maintain both adaptability and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layered structure effectively limits the flow of water and oxygen, enhancing the protection ability of the TFE and preventing performance failures by creating a robust barrier that reduces the likelihood of external moisture entering the OLED device.
Implementation Method 1
a first hydrophobic layer is disposed on the first organic buffer layer over the working area, wherein the first hydrophobic layer is provided with nano microstructures on a surface for limiting a boundary of the first organic buffer layer
Implementation Method 2
the first hydrophobic layer is provided with nano microstructures on a surface for limiting a boundary of the first organic buffer layer
Implementation Method 3
water and oxygen directly penetrate the TFE film layer from top to bottom into the OLED device
Data Source
AI summary
The present disclosure provides an organic light emitting diode display package structure and a method of manufacturing the same. The organic light emitting diode display package structure is provided with a gate insulating layer, a first barrier layer, a first organic buffer layer, a first hydrophobic layer, a second organic buffer layer, and a second barrier layer which are disposed sequentially. A double layer of the organic buffer layer has a thickness capable of wrapping the foreign matters in the area to lower the possibility that the water and oxygen pass through this area and enter OLED device to enhance the protection ability of the TFE on the OLED device.