OLED Heat Dissipation via Integrated Thermoelectric Cooling
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Solution Overview
Problem
Organic Light-Emitting Diodes (OLEDs) are prone to degradation due to oxygen sensitivity and inadequate heat dissipation, leading to overheating and reduced service life, despite being clad with glass to prevent oxygen contact.
Innovation Solution
Integration of a semiconductor thermoelectric refrigerating section on the light emitting device substrate, utilizing the thermoelectric effect to absorb and dissipate heat generated by the light emitting section, thereby lowering its operating temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass is used to clad the light emitting part of OLED, then oxygen protection is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent segments the protective structure into two distinct parts: glass cladding for oxygen protection and a metal heat dissipation plate for thermal management. This segmentation allows each component to specialize in its primary function without compromising the other, resolving the contradiction between oxygen protection and heat dissipation.
Solution Approach 2:
The metal heat dissipation plate serves multiple functions: it acts as a thermal management component for heat dissipation, provides structural support, and serves as a mounting base for the OLED module. This multi-functionality reduces the need for additional components while addressing the heat dissipation issue.
2Duration of action of stationary object
If glass cladding is used to protect OLED from oxygen, then service life is extended through oxygen protection, but heat generated during operation is not readily transferred out
Solution Approach 1:
The metal heat dissipation plate acts as an intermediary between the OLED light emitting module and the external environment. It receives heat from the OLED module through thermal conduction and transfers it to the surrounding air or heat sink, effectively mediating the heat transfer process while the glass cladding maintains oxygen protection.
Solution Approach 2:
The patent employs a composite structure combining glass (for oxygen barrier properties) and metal (for heat dissipation properties). This composite material approach allows the device to simultaneously achieve excellent oxygen protection and efficient heat transfer, resolving the contradiction between extending service life through protection and managing heat loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively improves heat dissipation and extends the service life of the light emitting device by maintaining lower working temperatures.
Implementation Method 1
the semiconductor thermoelectric refrigerating section, utilizing the thermoelectric effect principle, absorbs and dissipates heat generated by the light emitting section
Data Source
AI summary
There are provided a light emitting device and a method for manufacturing the same, which may effectively improve heat dissipation of the light emitting device and extend service life thereof. The light emitting device comprises a substrate (1) on which a light emitting section (2) is disposed, and the light emitting device further have a semiconductor thermoelectric refrigerating section (3) integrated thereon which is disposed on the light emitting section (2); the semiconductor refrigerating section (3) comprises a cold end (31) close to the light emitting section (2) and a hot end (32) away from the light emitting section (2).