OLED Display Panel Through Hole Sealing via Segmented Packaging
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Solution Overview
Problem
Current OLED display panel packaging technologies fail to prevent water and oxygen from permeating through holes, affecting display performance and potentially invalidating the display element.
Innovation Solution
A method involving the formation of a release layer on a substrate, followed by the creation of a hollow portion and subsequent packaging with a packaging adhesive, which includes forming a through hole surrounded by a packaging portion to prevent external water and oxygen from reaching the display element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a through hole is provided on the display panel to enable pointer design and appearance customization, then the appearance design freedom and user requirements are improved, but water and oxygen can permeate through the through hole to contact the display element, causing display performance degradation and element invalidation
Solution Approach 1:
The packaging structure is divided into multiple sealing layers: a first sealing layer (UV curing adhesive or glass cement) seals the periphery of the display element, while a second sealing layer (water-resistant thin film) seals the bottom surface of the display element. This segmented approach allows the through hole to pass through the display panel without compromising the sealing integrity, as water and oxygen must penetrate multiple sealed barriers to reach the display element.
Solution Approach 2:
A hollow portion is created between the display element and the substrate, filled with packaging adhesive that acts as an intermediary barrier. This packaging adhesive fills the space and provides additional protection against water and oxygen permeation through the through hole area, while still allowing the through hole to exist for pointer insertion.
2Reliability
If conventional packaging methods (UV curing adhesive or TFE process) are used to seal the display panel, then the display element is protected from water and oxygen, but the presence of a through hole renders these packaging methods ineffective as water and oxygen can still permeate through the through hole
Solution Approach 1:
The packaging is segmented into multiple sealing layers: a first sealing layer (UV curing adhesive or glass cement) seals the periphery of the display element, while a second sealing layer (water-resistant thin film) seals the bottom surface of the display element. This segmented approach allows the through hole to pass through the display panel without compromising the sealing integrity, as water and oxygen must penetrate multiple sealed barriers to reach the display element.
Solution Approach 2:
Different packaging methods are applied to different locations: the periphery area uses UV curing adhesive or glass cement bonding, while the bottom surface area uses water-resistant thin film deposition. The through hole area is specifically addressed by the hollow portion filled with packaging adhesive and the hollow portion sealing structure, creating localized quality variations that collectively provide comprehensive protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents water and oxygen from entering the display panel through the through hole, maintaining display performance and extending the service life of the panel.
Implementation Method 1
separating the release layer and the first substrate with a laser
Implementation Method 2
separating the release layer and the first substrate with a laser
Implementation Method 3
uses materials such as a ultraviolet (UV) curing adhesive or a glass (Frit) cement to bond a substrate and cover plate together
Implementation Method 4
the packaging adhesive is a glass cement, which is cured after laser sintering to bond the first substrate and the second substrate
Data Source
AI summary
The present disclosure discloses a method of manufacturing a display panel. The method includes: providing a first substrate, and forming a release layer on the first substrate; forming a thin film transistor driving layer on the first substrate; forming a display element on the first substrate, wherein a part of the display element forms above the release layer and another part of the display element forms above the thin film transistor driving layer; separating the release layer and the first substrate with a laser; removing the release layer and the display element above the release layer, and forming a hollow portion on the first substrate; packaging the display element to form a display panel, wherein the display panel at least includes a first packaging portion; and providing a through hole passing through the display panel at a region on the display panel corresponding to the hollow portion.